Process for metallization of a substrate by curing a catalyst applied thereto
Abstract
An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 874794
- Patent Number(s):
- 6461678
- Application Number:
- 08/845,814
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- process; metallization; substrate; curing; catalyst; applied; improved; additive; substrates; described; solution; surface; metallic; catalytic; clusters; formed; heating; electroless; plating; deposit; metal; portion; coated; additional; thickness; obtained; electrolytically; step; substrate surface; /427/205/
Citation Formats
Chen, Ken S, Morgan, William P, and Zich, John L. Process for metallization of a substrate by curing a catalyst applied thereto. United States: N. p., 2002.
Web.
Chen, Ken S, Morgan, William P, & Zich, John L. Process for metallization of a substrate by curing a catalyst applied thereto. United States.
Chen, Ken S, Morgan, William P, and Zich, John L. Tue .
"Process for metallization of a substrate by curing a catalyst applied thereto". United States. https://www.osti.gov/servlets/purl/874794.
@article{osti_874794,
title = {Process for metallization of a substrate by curing a catalyst applied thereto},
author = {Chen, Ken S and Morgan, William P and Zich, John L},
abstractNote = {An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 08 00:00:00 EDT 2002},
month = {Tue Oct 08 00:00:00 EDT 2002}
}
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