Cantilevered multilevel LIGA devices and methods

Morales, Alfredo Martin; Domeier, Linda A

Title: Cantilevered multilevel LIGA devices and methods

Abstract

In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.

Inventors:

Morales, Alfredo Martin ^[1]; Domeier, Linda A ^[2]

Pleasanton, CA
Danville, CA

Issue Date:: 2002-01-01

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:: 874775

Patent Number(s):: 6458263

Assignee:: Sandia National Laboratories (Livermore, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/76885 - {By forming conductive members before deposition of protective insulating material, e.g. pillars, studs}

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D1/003 - {3D structures, e.g. superposed patterned layers}

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F7/0035 - {Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface}

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D5/022 - {using masking means

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
B81C2201/032 - LIGA process
B81C1/00666 - {Treatments for controlling internal stress or strain in MEMS structures}
B81C2201/019 - Bonding or gluing multiple substrate layers

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
B81B2203/0118 - Cantilevers

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: cantilevered; multilevel; liga; devices; methods; formation; microstructures; preformed; sheet; photoresist; material; polymethylmethacrylate; pmma; patterned; exposure; mask; radiation; x-rays; developed; developer; remove; exposed; microstructure; formed; electroplating; metal; removed; additional; levels; added; initial; covering; conductive; polymer; machining; layer; reveal; surface; sealing; forming; level; structure; top; manner; multiple; layers; built; allow; complex; metal layer; conductive polymer; resist material; photoresist material; /205/430/

Citation Formats


                    Morales, Alfredo Martin, and Domeier, Linda A. Cantilevered multilevel LIGA devices and methods.  United States: N. p., 2002. 
        Web.

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                    Morales, Alfredo Martin, & Domeier, Linda A. Cantilevered multilevel LIGA devices and methods.  United States.

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                    Morales, Alfredo Martin, and Domeier, Linda A. Tue .  
        "Cantilevered multilevel LIGA devices and methods".  United States.  https://www.osti.gov/servlets/purl/874775.

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@article{osti_874775,

  title        = {Cantilevered multilevel LIGA devices and methods},

  author       = {Morales, Alfredo Martin and Domeier, Linda A},

  abstractNote = {In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2002},

  month        = {1}

}

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Works referenced in this record:

Various replication techniques for manufacturing three-dimensional metal microstructures
journal, December 1997

Ruprecht, R.; Benzler, T.; Hanemann, T.
Microsystem Technologies, Vol. 4, Issue 1
https://doi.org/10.1007/s005420050087

Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
journal, May 1986

Becker, E. W.; Ehrfeld, W.; Hagmann, P.
Microelectronic Engineering, Vol. 4, Issue 1, p. 35-56
https://doi.org/10.1016/0167-9317(86)90004-3

Molding of three dimensional microstructures by the LIGA process
conference, January 1992

Harmening, M.; Bacher, W.; Bley, P.
[1992] Proceedings IEEE Micro Electro Mechanical Systems
https://doi.org/10.1109/MEMSYS.1992.187718

Molding of LIGA microstructures from fluorinated polymers
journal, October 1996

Ruprecht, R.; Kalb, H.; Kowanz, B.
Microsystem Technologies, Vol. 2, Issue 4
https://doi.org/10.1007/s005420050041

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Title: Cantilevered multilevel LIGA devices and methods

Abstract

Citation Formats

Various replication techniques for manufacturing three-dimensional metal microstructures journal, December 1997

Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process) journal, May 1986

Molding of three dimensional microstructures by the LIGA process conference, January 1992

Molding of LIGA microstructures from fluorinated polymers journal, October 1996

Various replication techniques for manufacturing three-dimensional metal microstructures
journal, December 1997

Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
journal, May 1986

Molding of three dimensional microstructures by the LIGA process
conference, January 1992

Molding of LIGA microstructures from fluorinated polymers
journal, October 1996