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Title: Packaging of electro-microfluidic devices

Abstract

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Inventors:
 [1];  [1];  [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
874697
Patent Number(s):
6443179
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
F - MECHANICAL ENGINEERING F16 - ENGINEERING ELEMENTS AND UNITS F16K - VALVES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
packaging; electro-microfluidic; devices; architecture; surface; micromachined; relies; scales; bring; fluid; device; scale; picoliters; macro-scale; microliters; emulates; utilizes; electronics; technology; larger; package; consists; circuit; board; embedded; fluidic; channels; standard; connectors; printed; wiring; connect; dual-inline-package; emdip; takes; microfluidic; integrated; mic; connection; bosch-etched; holes; front; electrical; bond; pads; integrated circuit; electrical connection; microfluidic devices; /137/285/

Citation Formats

Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, and Watson, Robert D. Packaging of electro-microfluidic devices. United States: N. p., 2002. Web.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, & Watson, Robert D. Packaging of electro-microfluidic devices. United States.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, and Watson, Robert D. Tue . "Packaging of electro-microfluidic devices". United States. https://www.osti.gov/servlets/purl/874697.
@article{osti_874697,
title = {Packaging of electro-microfluidic devices},
author = {Benavides, Gilbert L and Galambos, Paul C and Emerson, John A and Peterson, Kenneth A and Giunta, Rachel K and Watson, Robert D},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

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Works referenced in this record:

Electroplated electro-fluidic interconnects for chemical sensors
journal, August 2000


Electrical and fluidic packaging of surface micromachined electromicrofluidic devices
conference, August 2000


Fluidic interconnects for modular assembly of chemical microsystems
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A new technology for fluidic microsystems based on PCB technology
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An integrated liquid mixer/valve
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A highly flexible design and production framework for modularized microelectromechanical systems
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Low-cost plastic sensor packaging using the open-window package concept
journal, May 1998