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Title: Thick adherent dielectric films on plastic substrates and method for depositing same

Abstract

Thick adherent dielectric films deposited on plastic substrates for use as a thermal barrier layer to protect the plastic substrates from high temperatures which, for example, occur during laser annealing of layers subsequently deposited on the dielectric films. It is desirable that the barrier layer has properties including: a thickness of 1 .mu.m or greater, adheres to a plastic substrate, does not lift-off when cycled in temperature, has few or no cracks and does not crack when subjected to bending, resistant to lift-off when submersed in fluids, electrically insulating and preferably transparent. The thick barrier layer may be composed, for example, of a variety of dielectrics and certain metal oxides, and may be deposited on a variety of plastic substrates by various known deposition techniques. The key to the method of forming the thick barrier layer on the plastic substrate is maintaining the substrate cool during deposition of the barrier layer. Cooling of the substrate maybe accomplished by the use of a cooling chuck on which the plastic substrate is positioned, and by directing cooling gas, such as He, Ar and N.sub.2, between the plastic substrate and the cooling chucks. Thick adherent dielectric films up to about 5 .mu.m havemore » been deposited on plastic substrates which include the above-referenced properties, and which enable the plastic substrates to withstand laser processing temperatures applied to materials deposited on the dielectric films.« less

Inventors:
 [1];  [2];  [3];  [4]
  1. (Walnut Creek, CA)
  2. (Fremont, CA)
  3. (Woodbury, MN)
  4. (San Ramon, CA)
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
874667
Patent Number(s):
6436739
Assignee:
The Regents of the University of California (Oakland, CA) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
thick; adherent; dielectric; films; plastic; substrates; method; depositing; deposited; thermal; barrier; layer; protect; temperatures; example; occur; laser; annealing; layers; subsequently; desirable; properties; including; thickness; mum; adheres; substrate; lift-off; cycled; temperature; cracks; crack; subjected; bending; resistant; submersed; fluids; electrically; insulating; transparent; composed; variety; dielectrics; metal; oxides; deposition; techniques; key; forming; maintaining; cool; cooling; accomplished; chuck; positioned; directing; gas; nsub2; chucks; above-referenced; enable; withstand; processing; applied; materials; metal oxide; electrically insulating; properties including; plastic substrate; films deposited; /438/

Citation Formats

Wickboldt, Paul, Ellingboe, Albert R., Theiss, Steven D., and Smith, Patrick M. Thick adherent dielectric films on plastic substrates and method for depositing same. United States: N. p., 2002. Web.
Wickboldt, Paul, Ellingboe, Albert R., Theiss, Steven D., & Smith, Patrick M. Thick adherent dielectric films on plastic substrates and method for depositing same. United States.
Wickboldt, Paul, Ellingboe, Albert R., Theiss, Steven D., and Smith, Patrick M. Tue . "Thick adherent dielectric films on plastic substrates and method for depositing same". United States. https://www.osti.gov/servlets/purl/874667.
@article{osti_874667,
title = {Thick adherent dielectric films on plastic substrates and method for depositing same},
author = {Wickboldt, Paul and Ellingboe, Albert R. and Theiss, Steven D. and Smith, Patrick M.},
abstractNote = {Thick adherent dielectric films deposited on plastic substrates for use as a thermal barrier layer to protect the plastic substrates from high temperatures which, for example, occur during laser annealing of layers subsequently deposited on the dielectric films. It is desirable that the barrier layer has properties including: a thickness of 1 .mu.m or greater, adheres to a plastic substrate, does not lift-off when cycled in temperature, has few or no cracks and does not crack when subjected to bending, resistant to lift-off when submersed in fluids, electrically insulating and preferably transparent. The thick barrier layer may be composed, for example, of a variety of dielectrics and certain metal oxides, and may be deposited on a variety of plastic substrates by various known deposition techniques. The key to the method of forming the thick barrier layer on the plastic substrate is maintaining the substrate cool during deposition of the barrier layer. Cooling of the substrate maybe accomplished by the use of a cooling chuck on which the plastic substrate is positioned, and by directing cooling gas, such as He, Ar and N.sub.2, between the plastic substrate and the cooling chucks. Thick adherent dielectric films up to about 5 .mu.m have been deposited on plastic substrates which include the above-referenced properties, and which enable the plastic substrates to withstand laser processing temperatures applied to materials deposited on the dielectric films.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

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