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Title: Sacrificial plastic mold with electroplatable base

Abstract

A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Inventors:
 [1];  [2];  [2]
  1. Danville, CA
  2. Livermore, CA
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
874603
Patent Number(s):
6422528
Assignee:
Sandia National Laboratories (Livermore, CA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
sacrificial; plastic; mold; electroplatable; base; provided; embodiment; consists; infusion; softened; molten; thermoplastic; porous; metal; substrate; sheet; screen; mesh; foam; features; micro-scale; molding; tool; contacting; demolding; embedded; structure; determined; provides; mechanically; bonded; conducting; support; electroplating; contiguous; non-contiguous; replicates; lapping; dissolved; leave; optionally; electroplated; structures; debonded; selective; dissolution; coating; porous metal; /249/

Citation Formats

Domeier, Linda A, Hruby, Jill M, and Morales, Alfredo M. Sacrificial plastic mold with electroplatable base. United States: N. p., 2002. Web.
Domeier, Linda A, Hruby, Jill M, & Morales, Alfredo M. Sacrificial plastic mold with electroplatable base. United States.
Domeier, Linda A, Hruby, Jill M, and Morales, Alfredo M. Tue . "Sacrificial plastic mold with electroplatable base". United States. https://www.osti.gov/servlets/purl/874603.
@article{osti_874603,
title = {Sacrificial plastic mold with electroplatable base},
author = {Domeier, Linda A and Hruby, Jill M and Morales, Alfredo M},
abstractNote = {A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}