skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Intergranular degradation assessment via random grain boundary network analysis

Abstract

A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to

Inventors:
 [1];  [2];  [1]
  1. San Ramon, CA
  2. Pleasanton, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
874473
Patent Number(s):
6397682
Assignee:
The United States of America as represented by the Department of Energy (Washington, DC)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
intergranular; degradation; assessment; via; random; grain; boundary; network; analysis; method; disclosed; determining; resistance; polycrystalline; materials; failure; igdf; analyzing; connectivity; rgbnc; microstructure; disruption; assess; effectiveness; processing; increasing; comparison; microstructures; exposed; extreme; operating; conditions; unexposed; diagnose; predict; onset; material; due; grain boundary; polycrystalline material; /73/

Citation Formats

Kumar, Mukul, Schwartz, Adam J, and King, Wayne E. Intergranular degradation assessment via random grain boundary network analysis. United States: N. p., 2002. Web.
Kumar, Mukul, Schwartz, Adam J, & King, Wayne E. Intergranular degradation assessment via random grain boundary network analysis. United States.
Kumar, Mukul, Schwartz, Adam J, and King, Wayne E. Tue . "Intergranular degradation assessment via random grain boundary network analysis". United States. https://www.osti.gov/servlets/purl/874473.
@article{osti_874473,
title = {Intergranular degradation assessment via random grain boundary network analysis},
author = {Kumar, Mukul and Schwartz, Adam J and King, Wayne E},
abstractNote = {A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

Save / Share:

Works referenced in this record:

Grain-boundary structure effects on intergranular stress corrosion cracking of alloy X-750
journal, December 1996


Combination Rule of Σ Values at Triple Junctions in Cubic Polycrystals
journal, November 1996


Ordered structures in random grain boundaries; some geometrical probabilities
journal, May 1975


The structure of high-angle grain boundaries
journal, November 1966


Coincidence-site lattices and complete pattern-shift in cubic crystals
journal, March 1974


Structure-dependence of intergranular corrosion in high purity nickel
journal, November 1990


A method of determining the coincidence site lattices for cubic crystals
journal, September 1974


On annealing twins and CSL distributions in F.C.C. polycrystals
journal, June 1992