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Title: Micromechanical die attachment surcharge

Abstract

An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.

Inventors:
 [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
874449
Patent Number(s):
6392144
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
micromechanical; die; attachment; surcharge; structure; disclosed; attaching; supporting; substrate; adhesives; solder; formed; micromachining; functions; purely; mechanically; utilizing; plurality; shaped; pillars; square; polygonal; solid; hollow; slotted; urged; contact; types; mating; structures; including; deformable; layer; receptacles; forming; friction; bond; holds; alignment; precise; positioning; facilitate; mounting; applications; semiconductor; containing; microelectromechanical; device; microsensor; integrated; circuit; form; multichip; module; useful; released; devices; fragile; otherwise; damaged; degraded; adhesive; integrated circuit; various types; supporting substrate; /174/

Citation Formats

Filter, William F., and Hohimer, John P. Micromechanical die attachment surcharge. United States: N. p., 2002. Web.
Filter, William F., & Hohimer, John P. Micromechanical die attachment surcharge. United States.
Filter, William F., and Hohimer, John P. Tue . "Micromechanical die attachment surcharge". United States. https://www.osti.gov/servlets/purl/874449.
@article{osti_874449,
title = {Micromechanical die attachment surcharge},
author = {Filter, William F. and Hohimer, John P.},
abstractNote = {An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

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