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Title: Substrate system for spray forming

Abstract

A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.

Inventors:
 [1];  [2]
  1. Export, PA
  2. Harrisburg, PA
Issue Date:
Research Org.:
Aluminum Company of America (Pittsburgh, PA)
OSTI Identifier:
874420
Patent Number(s):
6386266
Assignee:
Alcoa Inc. (Pittsburgh, PA)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
B - PERFORMING OPERATIONS B22 - CASTING B22F - WORKING METALLIC POWDER
DOE Contract Number:  
FC07-94ID13238
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
substrate; spray; forming; receiving; deposit; sprayed; metal; droplets; including; movable; outer; deposited; inner; disposed; adjacent; zones; differing; thermal; conductivity; resist; layer; porosity; formation; grains; coarse; constituent; particles; bulk; accumulated; apparatus; associated; method; molten; form; product; provided; molten metal; thermal conductivity; metal product; spray forming; substrate disposed; metal droplet; /164/

Citation Formats

Chu, Men G, and Chernicoff, William P. Substrate system for spray forming. United States: N. p., 2002. Web.
Chu, Men G, & Chernicoff, William P. Substrate system for spray forming. United States.
Chu, Men G, and Chernicoff, William P. Tue . "Substrate system for spray forming". United States. https://www.osti.gov/servlets/purl/874420.
@article{osti_874420,
title = {Substrate system for spray forming},
author = {Chu, Men G and Chernicoff, William P},
abstractNote = {A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

Patent:

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