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Title: Method for loading shape memory polymer gripper mechanisms

Abstract

A method and apparatus for loading deposit material, such as an embolic coil, into a shape memory polymer (SMP) gripping/release mechanism. The apparatus enables the application of uniform pressure to secure a grip by the SMP mechanism on the deposit material via differential pressure between, for example, vacuum within the SMP mechanism and hydrostatic water pressure on the exterior of the SMP mechanism. The SMP tubing material of the mechanism is heated to above the glass transformation temperature (Tg) while reshaping, and subsequently cooled to below Tg to freeze the shape. The heating and/or cooling may, for example, be provided by the same water applied for pressurization or the heating can be applied by optical fibers packaged to the SMP mechanism for directing a laser beam, for example, thereunto. At a point of use, the deposit material is released from the SMP mechanism by reheating the SMP material to above the temperature Tg whereby it returns to its initial shape. The reheating of the SMP material may be carried out by injecting heated fluid (water) through an associated catheter or by optical fibers and an associated beam of laser light, for example.

Inventors:
 [1];  [2];  [3];  [4];  [2]
  1. Walnut Creek, CA
  2. Livermore, CA
  3. Concord, CA
  4. Pleasanton, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
874344
Patent Number(s):
6370757
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Classifications (CPCs):
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61B - DIAGNOSIS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; loading; shape; memory; polymer; gripper; mechanisms; apparatus; deposit; material; embolic; coil; smp; grippingrelease; mechanism; enables; application; uniform; pressure; secure; grip; via; differential; example; vacuum; hydrostatic; water; exterior; tubing; heated; glass; transformation; temperature; tg; reshaping; subsequently; cooled; below; freeze; heating; andor; cooling; provided; applied; pressurization; optical; fibers; packaged; directing; laser; beam; thereunto; released; reheating; returns; initial; carried; injecting; fluid; associated; catheter; light; laser beam; optical fiber; laser light; temperature tg; memory polymer; release mechanism; deposit material; embolic coil; /29/

Citation Formats

Lee, Abraham P, Benett, William J, Schumann, Daniel L, Krulevitch, Peter A, and Fitch, Joseph P. Method for loading shape memory polymer gripper mechanisms. United States: N. p., 2002. Web.
Lee, Abraham P, Benett, William J, Schumann, Daniel L, Krulevitch, Peter A, & Fitch, Joseph P. Method for loading shape memory polymer gripper mechanisms. United States.
Lee, Abraham P, Benett, William J, Schumann, Daniel L, Krulevitch, Peter A, and Fitch, Joseph P. Tue . "Method for loading shape memory polymer gripper mechanisms". United States. https://www.osti.gov/servlets/purl/874344.
@article{osti_874344,
title = {Method for loading shape memory polymer gripper mechanisms},
author = {Lee, Abraham P and Benett, William J and Schumann, Daniel L and Krulevitch, Peter A and Fitch, Joseph P},
abstractNote = {A method and apparatus for loading deposit material, such as an embolic coil, into a shape memory polymer (SMP) gripping/release mechanism. The apparatus enables the application of uniform pressure to secure a grip by the SMP mechanism on the deposit material via differential pressure between, for example, vacuum within the SMP mechanism and hydrostatic water pressure on the exterior of the SMP mechanism. The SMP tubing material of the mechanism is heated to above the glass transformation temperature (Tg) while reshaping, and subsequently cooled to below Tg to freeze the shape. The heating and/or cooling may, for example, be provided by the same water applied for pressurization or the heating can be applied by optical fibers packaged to the SMP mechanism for directing a laser beam, for example, thereunto. At a point of use, the deposit material is released from the SMP mechanism by reheating the SMP material to above the temperature Tg whereby it returns to its initial shape. The reheating of the SMP material may be carried out by injecting heated fluid (water) through an associated catheter or by optical fibers and an associated beam of laser light, for example.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

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