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Title: Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections

Abstract

An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.

Inventors:
 [1];  [2];  [3]
  1. Danville, CA
  2. Cardiff, CA
  3. Livermore, CA
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
874275
Patent Number(s):
6355147
Assignee:
Sandia Corporation (Livermore, CA)
Patent Classifications (CPCs):
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
porous; electrode; apparatus; electrodeposition; detailed; metal; structures; microelectronic; interconnections; procedure; performing; microfabrication; electroforming; deposits; cavities; primary; application; liga; process; manufactures; complex; three-dimensional; damascene; electroplating; line; via; devices; held; contact; close; proximity; plating; substrate; mold; top; ensure; one-dimensional; uniform; current; flow; electrolyte; pumped; exposed; surface; concentrations; external; prevents; circulation; individual; avoiding; preferential; enhancement; transport; favorable; geometries; identical; grow; rate; eliminating; nonuniformities; prior; current flow; exposed surface; electrode apparatus; forming metal; metal structure; metal deposit; /204/

Citation Formats

Griffiths, Stewart K, Nilson, Robert H, and Hruby, Jill M. Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections. United States: N. p., 2002. Web.
Griffiths, Stewart K, Nilson, Robert H, & Hruby, Jill M. Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections. United States.
Griffiths, Stewart K, Nilson, Robert H, and Hruby, Jill M. Tue . "Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections". United States. https://www.osti.gov/servlets/purl/874275.
@article{osti_874275,
title = {Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections},
author = {Griffiths, Stewart K and Nilson, Robert H and Hruby, Jill M},
abstractNote = {An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

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