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Title: Protection of microelectronic devices during packaging

Abstract

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Inventors:
 [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
874193
Patent Number(s):
6335224
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
protection; microelectronic; devices; packaging; relates; method; protecting; device; including; steps; applying; water-insoluble; protective; coating; sensitive; performing; step; substantially; removing; dry; plasma; etching; released; mems; element; disposed; wafer; vacuum; vapor-deposited; parylene; polymer; silicon; nitride; metal; aluminum; tungsten; vapor; deposited; organic; material; cynoacrylate; carbon; film; self-assembled; monolayered; perfluoropolyether; hexamethyldisilazane; perfluorodecanoic; carboxylic; acid; dioxide; silicate; glass; combinations; providing; package; attaching; electrically; interconnecting; silicon nitride; vapor deposited; electronic device; /438/

Citation Formats

Peterson, Kenneth A, and Conley, William R. Protection of microelectronic devices during packaging. United States: N. p., 2002. Web.
Peterson, Kenneth A, & Conley, William R. Protection of microelectronic devices during packaging. United States.
Peterson, Kenneth A, and Conley, William R. Tue . "Protection of microelectronic devices during packaging". United States. https://www.osti.gov/servlets/purl/874193.
@article{osti_874193,
title = {Protection of microelectronic devices during packaging},
author = {Peterson, Kenneth A and Conley, William R},
abstractNote = {The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {1}
}

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Works referenced in this record:

Electrically removable, micromachined encapsulation for sensitive materials
journal, July 1997


Photolithographic packaging of silicon pressure sensors
journal, April 1998