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Title: Method of making thermally removable polymeric encapsulants

Abstract

A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.

Inventors:
 [1];  [2];  [2];  [2];  [3]
  1. Santa Fe, NM
  2. Albuquerque, NM
  3. late of Albuquerque, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
873916
Patent Number(s):
6271335
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08F - MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; thermally; removable; polymeric; encapsulants; thermally-removable; encapsulant; heating; mixture; bis; maleimide; compound; monomeric; tris; furan; tetrakis; temperatures; temperature; approximately; 90; degree; form; cooling; easily; removed; hour; preferably; polar; solvent; protecting; electronic; components; require; subsequent; removal; component; repair; modification; quality; control; polar solvent; easily removed; electronic components; subsequent removal; /528/264/525/

Citation Formats

Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, and Saunders, Randall S. Method of making thermally removable polymeric encapsulants. United States: N. p., 2001. Web.
Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, & Saunders, Randall S. Method of making thermally removable polymeric encapsulants. United States.
Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, and Saunders, Randall S. Mon . "Method of making thermally removable polymeric encapsulants". United States. https://www.osti.gov/servlets/purl/873916.
@article{osti_873916,
title = {Method of making thermally removable polymeric encapsulants},
author = {Small, James H and Loy, Douglas A and Wheeler, David R and McElhanon, James R and Saunders, Randall S},
abstractNote = {A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Works referenced in this record:

The application of the Diels-Alder reaction to polymers bearing furan moieties. 1. Reactions with maleimides
journal, August 1997