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Title: Reflective optical imaging method and circuit

Abstract

An optical system compatible with short wavelength (extreme ultraviolet) radiation comprising four reflective elements for projecting a mask image onto a substrate. The four optical elements are characterized in order from object to image as convex, concave, convex and concave mirrors. The optical system is particularly suited for step and scan lithography methods. The invention increases the slit dimensions associated with ringfield scanning optics, improves wafer throughput and allows higher semiconductor device density.

Inventors:
 [1]
  1. Fairfield, CT
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
OSTI Identifier:
873869
Patent Number(s):
6262826
Assignee:
Regents of University of California (Oakland, CA)
Patent Classifications (CPCs):
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
reflective; optical; imaging; method; circuit; compatible; wavelength; extreme; ultraviolet; radiation; comprising; elements; projecting; mask; image; substrate; characterized; convex; concave; mirrors; particularly; suited; step; scan; lithography; methods; increases; slit; dimensions; associated; ringfield; scanning; optics; improves; wafer; throughput; allows; semiconductor; device; density; reflective elements; concave mirrors; mask image; scan lithography; lithography methods; reflective optical; optical imaging; particularly suited; optical element; optical elements; extreme ultraviolet; semiconductor device; concave mirror; radiation comprising; reflective element; slit dimensions; scanning optics; device density; wafer throughput; imaging method; dimensions associated; improves wafer; field scanning; /359/

Citation Formats

Shafer, David R. Reflective optical imaging method and circuit. United States: N. p., 2001. Web.
Shafer, David R. Reflective optical imaging method and circuit. United States.
Shafer, David R. Mon . "Reflective optical imaging method and circuit". United States. https://www.osti.gov/servlets/purl/873869.
@article{osti_873869,
title = {Reflective optical imaging method and circuit},
author = {Shafer, David R},
abstractNote = {An optical system compatible with short wavelength (extreme ultraviolet) radiation comprising four reflective elements for projecting a mask image onto a substrate. The four optical elements are characterized in order from object to image as convex, concave, convex and concave mirrors. The optical system is particularly suited for step and scan lithography methods. The invention increases the slit dimensions associated with ringfield scanning optics, improves wafer throughput and allows higher semiconductor device density.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Works referenced in this record:

Design of reflective relay for soft x-ray lithography
conference, January 1991


Reflective systems design study for soft x-ray projection lithography
journal, November 1990