Lead-free solder
Abstract
A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.
- Inventors:
-
- Ames, IA
- Issue Date:
- Research Org.:
- Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
- OSTI Identifier:
- 873728
- Patent Number(s):
- 6231691
- Application Number:
- 08/796,471
- Assignee:
- Iowa State University Research Foundation, Inc. (Ames, IA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- DOE Contract Number:
- W-7405-ENG-82
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- lead-free; solder; sn-ag-cu; eutectic; alloy; modified; level; cost; additions; enhance; temperature; microstructural; stability; thermal-mechanical; fatigue; strength; decreasing; solderability; purposeful; fourth; fifth; element; collective; amount; exceeding; weight; wt; added; based; ternary; sn-4; ag-1; cu; selected; consisting; essentially; like-acting; elements; modifiers; intermetallic; interface; substrate; improve; joint; ternary eutectic; consisting essentially; structural stability; eutectic alloy; temperature solder; solder alloy; eutectic solder; lead-free solder; /148/228/420/
Citation Formats
Anderson, Iver E, and Terpstra, Robert L. Lead-free solder. United States: N. p., 2001.
Web.
Anderson, Iver E, & Terpstra, Robert L. Lead-free solder. United States.
Anderson, Iver E, and Terpstra, Robert L. Mon .
"Lead-free solder". United States. https://www.osti.gov/servlets/purl/873728.
@article{osti_873728,
title = {Lead-free solder},
author = {Anderson, Iver E and Terpstra, Robert L},
abstractNote = {A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}
Works referenced in this record:
Developing lead-free solders: A challenge and opportunity
journal, July 1993
- Jin, Sungho
- JOM, Vol. 45, Issue 7