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Title: Monolith electroplating process

Abstract

An electroplating process for preparing a monolith metal layer over a polycrystalline base metal and the plated monolith product. A monolith layer has a variable thickness of one crystal. The process is typically carried in molten salts electrolytes, such as the halide salts under an inert atmosphere at an elevated temperature, and over deposition time periods and film thickness sufficient to sinter and recrystallize completely the nucleating metal particles into one single crystal or crystals having very large grains. In the process, a close-packed film of submicron particle (20) is formed on a suitable substrate at an elevated temperature. The temperature has the significance of annealing particles as they are formed, and substrates on which the particles can populate are desirable. As the packed bed thickens, the submicron particles develop necks (21) and as they merge into each other shrinkage (22) occurs. Then as micropores also close (23) by surface tension, metal density is reached and the film consists of unstable metal grain (24) that at high enough temperature recrystallize (25) and recrystallized grains grow into an annealed single crystal over the electroplating time span. While cadmium was used in the experimental work, other soft metals may be used.

Inventors:
 [1]
  1. 1410 S. Busse Rd., 2K, Mt. Prospect, IL 60056
Issue Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
OSTI Identifier:
873597
Patent Number(s):
6200453
Assignee:
Agarrwal, Rajev R. (1410 S. Busse Rd., 2K, Mt. Prospect, IL 60056)
Patent Classifications (CPCs):
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
DOE Contract Number:  
W-31109-ENG-38
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
monolith; electroplating; process; preparing; metal; layer; polycrystalline; base; plated; product; variable; thickness; crystal; typically; carried; molten; salts; electrolytes; halide; inert; atmosphere; elevated; temperature; deposition; time; periods; film; sufficient; sinter; recrystallize; completely; nucleating; particles; single; crystals; grains; close-packed; submicron; particle; 20; formed; suitable; substrate; significance; annealing; substrates; populate; desirable; packed; bed; thickens; necks; 21; merge; shrinkage; 22; occurs; micropores; close; 23; surface; tension; density; reached; consists; unstable; grain; 24; 25; recrystallized; grow; annealed; span; cadmium; experimental; soft; metals; metal particle; thickness sufficient; packed bed; film thickness; metal particles; metal layer; elevated temperature; molten salt; time period; single crystal; inert atmosphere; base metal; surface tension; time periods; suitable substrate; halide salt; stable metal; soft metal; halide salts; variable thickness; electroplating process; plating process; /205/

Citation Formats

Agarrwal, Rajev R. Monolith electroplating process. United States: N. p., 2001. Web.
Agarrwal, Rajev R. Monolith electroplating process. United States.
Agarrwal, Rajev R. Mon . "Monolith electroplating process". United States. https://www.osti.gov/servlets/purl/873597.
@article{osti_873597,
title = {Monolith electroplating process},
author = {Agarrwal, Rajev R},
abstractNote = {An electroplating process for preparing a monolith metal layer over a polycrystalline base metal and the plated monolith product. A monolith layer has a variable thickness of one crystal. The process is typically carried in molten salts electrolytes, such as the halide salts under an inert atmosphere at an elevated temperature, and over deposition time periods and film thickness sufficient to sinter and recrystallize completely the nucleating metal particles into one single crystal or crystals having very large grains. In the process, a close-packed film of submicron particle (20) is formed on a suitable substrate at an elevated temperature. The temperature has the significance of annealing particles as they are formed, and substrates on which the particles can populate are desirable. As the packed bed thickens, the submicron particles develop necks (21) and as they merge into each other shrinkage (22) occurs. Then as micropores also close (23) by surface tension, metal density is reached and the film consists of unstable metal grain (24) that at high enough temperature recrystallize (25) and recrystallized grains grow into an annealed single crystal over the electroplating time span. While cadmium was used in the experimental work, other soft metals may be used.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}