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Title: Buffer layers on metal surfaces having biaxial texture as superconductor substrates

Abstract

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /Ni, (RE=Rare Earth), RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /CeO.sub.2 /Ni, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /CeO.sub.2 /Cu, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

Inventors:
 [1];  [1];  [1];  [1]
+ Show Inventor Affiliations
  1. Knoxville, TN
Issue Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
OSTI Identifier:
873424
Patent Number(s):
6156376
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
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DOE Contract Number:  
AC05-96OR22464
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
buffer; layers; metal; surfaces; biaxial; texture; superconductor; substrates; layer; architectures; epitaxially; deposited; biaxially-textured; rolled; nickel; copper; alloys; current; conductors; particularly; ysz; rare; earth; ceo; cu; deposition; methods; physical; vapor; techniques; electron-beam; evaporation; rf; magnetron; sputtering; pulsed; laser; thermal; solution; precursor; approaches; chemical; combustion; cvd; metal-organic; decomposition; sol-gel; processing; plasma; spray; sol-gel process; magnetron sputter; rf magnetron; current conductor; current conductors; deposition methods; magnetron sputtering; deposition method; plasma spray; epitaxially deposited; metal surface; buffer layer; metal surfaces; chemical vapor; rare earth; vapor deposition; pulsed laser; physical vapor; deposition techniques; layer architectures; buffer layers; biaxial texture; laser deposition; solution precursor; rolled substrates; sol-gel processing; biaxially-textured rolled; precursor approaches; particularly buffer; metal-organic decomposition; thermal evaporation; superconductor substrates; deposition technique; combustion cvd; electron-beam evaporation; beam evaporation; /427/

Citation Formats

Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, and Goyal, Amit. Buffer layers on metal surfaces having biaxial texture as superconductor substrates. United States: N. p., 2000. Web.
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Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, & Goyal, Amit. Buffer layers on metal surfaces having biaxial texture as superconductor substrates. United States.
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Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, and Goyal, Amit. Sat . "Buffer layers on metal surfaces having biaxial texture as superconductor substrates". United States. https://www.osti.gov/servlets/purl/873424.
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@article{osti_873424,
title = {Buffer layers on metal surfaces having biaxial texture as superconductor substrates},
author = {Paranthaman, Mariappan and Lee, Dominic F and Kroeger, Donald M and Goyal, Amit},
abstractNote = {Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /Ni, (RE=Rare Earth), RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /CeO.sub.2 /Ni, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /CeO.sub.2 /Cu, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}
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Works referenced in this record:

High current YBa 2 Cu 3 O 7−δ thick films on flexible nickel substrates with textured buffer layers
journal, October 1994

Growth of biaxially textured buffer layers on rolled-Ni substrates by electron beam evaporation
journal, February 1997

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