skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Buffer layers on rolled nickel or copper as superconductor substrates

Abstract

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

Inventors:
 [1];  [1];  [1];  [1]
  1. (Knoxville, TN)
Issue Date:
Research Org.:
LOCKHEED MARTIN ENERGY RES COR
OSTI Identifier:
873388
Patent Number(s):
6150034
Assignee:
UT-Battelle, LLC (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-96OR22464
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
buffer; layers; rolled; nickel; copper; superconductor; substrates; layer; architectures; epitaxially; deposited; biaxially-textured; alloys; current; conductors; particularly; ysz; ceo; rare; earth; cu; deposition; methods; physical; vapor; techniques; electron-beam; evaporation; rf; magnetron; sputtering; pulsed; laser; thermal; solution; precursor; approach; chemical; combustion; cvd; metal-organic; decomposition; sol-gel; processing; plasma; spray; sol-gel process; magnetron sputter; rf magnetron; current conductor; current conductors; deposition methods; magnetron sputtering; deposition method; plasma spray; epitaxially deposited; buffer layer; chemical vapor; rare earth; vapor deposition; pulsed laser; physical vapor; deposition techniques; layer architectures; buffer layers; laser deposition; solution precursor; rolled substrates; sol-gel processing; biaxially-textured rolled; particularly buffer; metal-organic decomposition; thermal evaporation; superconductor substrates; deposition technique; combustion cvd; rolled nickel; electron-beam evaporation; beam evaporation; /428/

Citation Formats

Paranthaman, Mariappan, Lee, Dominic F., Kroeger, Donald M., and Goyal, Amit. Buffer layers on rolled nickel or copper as superconductor substrates. United States: N. p., 2000. Web.
Paranthaman, Mariappan, Lee, Dominic F., Kroeger, Donald M., & Goyal, Amit. Buffer layers on rolled nickel or copper as superconductor substrates. United States.
Paranthaman, Mariappan, Lee, Dominic F., Kroeger, Donald M., and Goyal, Amit. Sat . "Buffer layers on rolled nickel or copper as superconductor substrates". United States. https://www.osti.gov/servlets/purl/873388.
@article{osti_873388,
title = {Buffer layers on rolled nickel or copper as superconductor substrates},
author = {Paranthaman, Mariappan and Lee, Dominic F. and Kroeger, Donald M. and Goyal, Amit},
abstractNote = {Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

Save / Share: