Method for forming porous platinum films
Abstract
A method for forming a platinum film includes providing a substrate, sputtering a crystalline platinum oxide layer over at least a portion of the substrate, and reducing the crystalline platinum oxide layer to form the platinum film. A device includes a non-conductive substrate and a platinum layer having a density of between about 2 and 5 g/cm.sup.3 formed over at least a portion of the non-conductive substrate. The platinum films produced in accordance with the present invention provide porous films suitable for use as electrodes, yet require few processing steps. Thus, such films are less costly. Such films may be formed on both conductive and non-conductive substrates. While the invention has been illustrated with platinum, other metals, such as noble metals, that form a low density oxide when reactively sputtered may also be used.
- Inventors:
-
- Oak Ridge, TN
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 873332
- Patent Number(s):
- 6136704
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01M - PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- DOE Contract Number:
- AC05-96OR22464
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; forming; porous; platinum; films; film; providing; substrate; sputtering; crystalline; oxide; layer; portion; reducing; form; device; non-conductive; density; cm; formed; produced; accordance; provide; suitable; electrodes; require; processing; steps; costly; conductive; substrates; illustrated; metals; noble; reactively; sputtered; noble metals; conductive substrate; noble metal; oxide layer; processing steps; processing step; non-conductive substrate; non-conductive substrates; films produced; forming porous; porous film; platinum film; platinum oxide; crystalline platinum; /438/
Citation Formats
Maya, Leon. Method for forming porous platinum films. United States: N. p., 2000.
Web.
Maya, Leon. Method for forming porous platinum films. United States.
Maya, Leon. Sat .
"Method for forming porous platinum films". United States. https://www.osti.gov/servlets/purl/873332.
@article{osti_873332,
title = {Method for forming porous platinum films},
author = {Maya, Leon},
abstractNote = {A method for forming a platinum film includes providing a substrate, sputtering a crystalline platinum oxide layer over at least a portion of the substrate, and reducing the crystalline platinum oxide layer to form the platinum film. A device includes a non-conductive substrate and a platinum layer having a density of between about 2 and 5 g/cm.sup.3 formed over at least a portion of the non-conductive substrate. The platinum films produced in accordance with the present invention provide porous films suitable for use as electrodes, yet require few processing steps. Thus, such films are less costly. Such films may be formed on both conductive and non-conductive substrates. While the invention has been illustrated with platinum, other metals, such as noble metals, that form a low density oxide when reactively sputtered may also be used.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}
Works referenced in this record:
Mesoporous Platinum Films from Lyotropic Liquid Crystalline Phases
journal, October 1997
- Attard, G. S.
- Science, Vol. 278, Issue 5339
Sputtered gold films for surface-enhanced Raman scattering
journal, March 1997
- Maya, L.; Vallet, C. E.; Lee, Y. H.
- Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 15, Issue 2
The behaviour of platinized platinum electrodes in acid solutions: correlation between voltammetric data and electrode structure
journal, September 1986
- Kessler, T.; Castro Luna, A. M.; Triaca, W. E.
- Journal of Applied Electrochemistry, Vol. 16, Issue 5