Resistive hydrogen sensing element
Abstract
Systems and methods are described for providing a hydrogen sensing element with a more robust exposed metallization by application of a discontinuous or porous overlay to hold the metallization firmly on the substrate. An apparatus includes: a substantially inert, electrically-insulating substrate; a first Pd containing metallization deposited upon the substrate and completely covered by a substantially hydrogen-impermeable layer so as to form a reference resistor on the substrate; a second Pd containing metallization deposited upon the substrate and at least a partially accessible to a gas to be tested, so as to form a hydrogen-sensing resistor; a protective structure disposed upon at least a portion of the second Pd containing metallization and at least a portion of the substrate to improve the attachment of the second Pd containing metallization to the substrate while allowing the gas to contact said the second Pd containing metallization; and a resistance bridge circuit coupled to both the first and second Pd containing metallizations. The circuit determines the difference in electrical resistance between the first and second Pd containing metallizations. The hydrogen concentration in the gas may be determined. The systems and methods provide advantages because adhesion is improved without adversely effecting measurement speed ormore »
- Inventors:
-
- Oak Ridge, TN
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 873222
- Patent Number(s):
- 6114943
- Assignee:
- Ut-Battelle, L.L.C. (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01C - RESISTORS
- DOE Contract Number:
- AC05-96OR22464
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- resistive; hydrogen; sensing; element; systems; methods; described; providing; robust; exposed; metallization; application; discontinuous; porous; overlay; hold; firmly; substrate; apparatus; substantially; inert; electrically-insulating; pd; containing; deposited; completely; covered; hydrogen-impermeable; layer; form; reference; resistor; partially; accessible; gas; tested; hydrogen-sensing; protective; structure; disposed; portion; improve; attachment; allowing; contact; resistance; bridge; circuit; coupled; metallizations; determines; difference; electrical; concentration; determined; provide; advantages; adhesion; improved; adversely; effecting; measurement; speed; sensitivity; substantially inert; hydrogen concentration; electrical resistance; sensing element; bridge circuit; provide advantages; containing metal; structure disposed; methods provide; metallization deposited; circuit coupled; circuit determines; insulating substrate; electrically-insulating substrate; completely cover; hydrogen sensing; permeable layer; /338/73/
Citation Formats
Lauf, Robert J. Resistive hydrogen sensing element. United States: N. p., 2000.
Web.
Lauf, Robert J. Resistive hydrogen sensing element. United States.
Lauf, Robert J. Sat .
"Resistive hydrogen sensing element". United States. https://www.osti.gov/servlets/purl/873222.
@article{osti_873222,
title = {Resistive hydrogen sensing element},
author = {Lauf, Robert J},
abstractNote = {Systems and methods are described for providing a hydrogen sensing element with a more robust exposed metallization by application of a discontinuous or porous overlay to hold the metallization firmly on the substrate. An apparatus includes: a substantially inert, electrically-insulating substrate; a first Pd containing metallization deposited upon the substrate and completely covered by a substantially hydrogen-impermeable layer so as to form a reference resistor on the substrate; a second Pd containing metallization deposited upon the substrate and at least a partially accessible to a gas to be tested, so as to form a hydrogen-sensing resistor; a protective structure disposed upon at least a portion of the second Pd containing metallization and at least a portion of the substrate to improve the attachment of the second Pd containing metallization to the substrate while allowing the gas to contact said the second Pd containing metallization; and a resistance bridge circuit coupled to both the first and second Pd containing metallizations. The circuit determines the difference in electrical resistance between the first and second Pd containing metallizations. The hydrogen concentration in the gas may be determined. The systems and methods provide advantages because adhesion is improved without adversely effecting measurement speed or sensitivity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}