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Title: 3-D laser patterning process utilizing horizontal and vertical patterning

Abstract

A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.

Inventors:
 [1];  [2]
  1. (Livermore, CA)
  2. (Berkeley, CA)
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
873215
Patent Number(s):
6114097
Assignee:
Regents of University of California (Oakland, CA) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
3-d; laser; patterning; process; utilizing; horizontal; vertical; vastly; improves; capability; pantography; computer; controlled; direct-write; commercially; available; electrodeposited; photoresist; edpr; pattern; surfaces; covers; surface; metal; layer; conformally; coating; pantograph; patterns; subsequently; developed; standard; developer; leaving; patterned; trench; thereunder; exposed; masked; thereafter; etched; form; desired; subtractive; plated; additive; followed; resist; stripping; removal; remaining; field; improved; simpler; faster; move; manufacturable; requires; micro-machining; additive process; computer controlled; metal layer; commercially available; process utilizing; computer control; desired pattern; laser patterning; improved laser; horizontal surface; laser pantography; field metal; vastly improves; controlled laser; laser pantograph; /430/

Citation Formats

Malba, Vincent, and Bernhardt, Anthony F. 3-D laser patterning process utilizing horizontal and vertical patterning. United States: N. p., 2000. Web.
Malba, Vincent, & Bernhardt, Anthony F. 3-D laser patterning process utilizing horizontal and vertical patterning. United States.
Malba, Vincent, and Bernhardt, Anthony F. Sat . "3-D laser patterning process utilizing horizontal and vertical patterning". United States. https://www.osti.gov/servlets/purl/873215.
@article{osti_873215,
title = {3-D laser patterning process utilizing horizontal and vertical patterning},
author = {Malba, Vincent and Bernhardt, Anthony F.},
abstractNote = {A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

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