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Title: Reduction of particle deposition on substrates using temperature gradient control

Abstract

A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.

Inventors:
 [1];  [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
873199
Patent Number(s):
6110844
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
reduction; particle; deposition; substrates; temperature; gradient; control; method; reducing; fabrication; microelectronic; circuitry; accomplished; controlling; relative; temperatures; various; near; surface; taking; exists; repel; particles; producing; cleaner; surfaces; obtaining; yields; process; microelectronic fabrication; electronic circuit; particle deposition; temperature gradient; electronic circuitry; fabrication process; reducing particle; gradient control; microelectronic circuit; /438/

Citation Formats

Rader, Daniel J., Dykhuizen, Ronald C., and Geller, Anthony S. Reduction of particle deposition on substrates using temperature gradient control. United States: N. p., 2000. Web.
Rader, Daniel J., Dykhuizen, Ronald C., & Geller, Anthony S. Reduction of particle deposition on substrates using temperature gradient control. United States.
Rader, Daniel J., Dykhuizen, Ronald C., and Geller, Anthony S. Sat . "Reduction of particle deposition on substrates using temperature gradient control". United States. https://www.osti.gov/servlets/purl/873199.
@article{osti_873199,
title = {Reduction of particle deposition on substrates using temperature gradient control},
author = {Rader, Daniel J. and Dykhuizen, Ronald C. and Geller, Anthony S.},
abstractNote = {A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

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