Reduction of particle deposition on substrates using temperature gradient control
Abstract
A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 873199
- Patent Number(s):
- 6110844
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- reduction; particle; deposition; substrates; temperature; gradient; control; method; reducing; fabrication; microelectronic; circuitry; accomplished; controlling; relative; temperatures; various; near; surface; taking; exists; repel; particles; producing; cleaner; surfaces; obtaining; yields; process; microelectronic fabrication; electronic circuit; particle deposition; temperature gradient; electronic circuitry; fabrication process; reducing particle; gradient control; microelectronic circuit; /438/
Citation Formats
Rader, Daniel J, Dykhuizen, Ronald C, and Geller, Anthony S. Reduction of particle deposition on substrates using temperature gradient control. United States: N. p., 2000.
Web.
Rader, Daniel J, Dykhuizen, Ronald C, & Geller, Anthony S. Reduction of particle deposition on substrates using temperature gradient control. United States.
Rader, Daniel J, Dykhuizen, Ronald C, and Geller, Anthony S. Sat .
"Reduction of particle deposition on substrates using temperature gradient control". United States. https://www.osti.gov/servlets/purl/873199.
@article{osti_873199,
title = {Reduction of particle deposition on substrates using temperature gradient control},
author = {Rader, Daniel J and Dykhuizen, Ronald C and Geller, Anthony S},
abstractNote = {A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}
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