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Title: Epoxy bond and stop etch fabrication method

Abstract

A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.

Inventors:
 [1];  [2];  [3]
  1. (Sandia Park, NM)
  2. (Pleasanton, CA)
  3. (Albuquerque, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
873192
Patent Number(s):
6110393
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
epoxy; bond; stop; etch; fabrication; method; ebase; microelectronic; techniques; disclosed; essence; grow; circuit; components; top; layer; grown; substrate; host; bonded; attached; bonding; agent; removed; chemical; physical; etching; process; resistant; methods; allow; access; regions; device; structure; blocked; presence; particular; utility; ultrafast; electronic; optoelectronic; devices; circuits; circuit component; microelectronic fabrication; stop etch; fabrication method; bonding agent; etching process; electronic devices; circuit components; fabrication techniques; particular utility; allow access; electronic device; fabrication methods; epoxy bond; optoelectronic device; layer grown; /216/204/438/

Citation Formats

Simmons, Jerry A., Weckwerth, Mark V., and Baca, Wes E. Epoxy bond and stop etch fabrication method. United States: N. p., 2000. Web.
Simmons, Jerry A., Weckwerth, Mark V., & Baca, Wes E. Epoxy bond and stop etch fabrication method. United States.
Simmons, Jerry A., Weckwerth, Mark V., and Baca, Wes E. Sat . "Epoxy bond and stop etch fabrication method". United States. https://www.osti.gov/servlets/purl/873192.
@article{osti_873192,
title = {Epoxy bond and stop etch fabrication method},
author = {Simmons, Jerry A. and Weckwerth, Mark V. and Baca, Wes E.},
abstractNote = {A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

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