Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film
Abstract
A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.
- Inventors:
-
- (Albuquerque, NM)
- (Placitas, NM)
- Issue Date:
- Research Org.:
- SANDIA CORP
- OSTI Identifier:
- 873158
- Patent Number(s):
- 6103305
- Assignee:
- Sandia Corporation (Albuquerque, NM) SNL
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; forming; stress; relieved; amorphous; tetrahedrally-coordinated; carbon; film; stress-relieved; amorphous-diamond; formed; depositing; diamond; specific; atomic; structure; bonding; substrate; annealing; sufficiently; temperature; relieve; compressive; significantly; softening; maximum; preferably; 650; degree; value; expected; behavior; materials; amorphous diamond; carbon film; diamond film; compressive stress; annealing temperature; specific atomic; relieved amorphous; coordinated carbon; /427/
Citation Formats
Friedmann, Thomas A., and Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film. United States: N. p., 2000.
Web.
Friedmann, Thomas A., & Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film. United States.
Friedmann, Thomas A., and Sullivan, John P. Sat .
"Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film". United States. https://www.osti.gov/servlets/purl/873158.
@article{osti_873158,
title = {Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film},
author = {Friedmann, Thomas A. and Sullivan, John P.},
abstractNote = {A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}
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