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Title: Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film

Abstract

A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.

Inventors:
 [1];  [2]
  1. (Albuquerque, NM)
  2. (Placitas, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
873158
Patent Number(s):
6103305
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; forming; stress; relieved; amorphous; tetrahedrally-coordinated; carbon; film; stress-relieved; amorphous-diamond; formed; depositing; diamond; specific; atomic; structure; bonding; substrate; annealing; sufficiently; temperature; relieve; compressive; significantly; softening; maximum; preferably; 650; degree; value; expected; behavior; materials; amorphous diamond; carbon film; diamond film; compressive stress; annealing temperature; specific atomic; relieved amorphous; coordinated carbon; /427/

Citation Formats

Friedmann, Thomas A., and Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film. United States: N. p., 2000. Web.
Friedmann, Thomas A., & Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film. United States.
Friedmann, Thomas A., and Sullivan, John P. Sat . "Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film". United States. https://www.osti.gov/servlets/purl/873158.
@article{osti_873158,
title = {Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film},
author = {Friedmann, Thomas A. and Sullivan, John P.},
abstractNote = {A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

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