Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film

Friedmann, Thomas A; Sullivan, John P

Title: Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film

Abstract

A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.

Inventors:

Friedmann, Thomas A ^[1]; Sullivan, John P ^[2]

Albuquerque, NM
Placitas, NM

Issue Date:: 2000-01-01

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:: 873158

Patent Number(s):: 6103305

Assignee:: Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):: C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

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C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C14/0005 - {Separation of the coating from the substrate}
C23C14/28 - by wave energy or particle radiation
C23C14/5806 - {Thermal treatment}
C23C14/0605 - {Carbon}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S427/104 - Utilizing low energy electromagnetic radiation, e.g. microwave, radio wave, IR, UV, visible, actinic laser
Y10S427/103 - Diamond-like carbon coating, i.e. DLC

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: method; forming; stress; relieved; amorphous; tetrahedrally-coordinated; carbon; film; stress-relieved; amorphous-diamond; formed; depositing; diamond; specific; atomic; structure; bonding; substrate; annealing; sufficiently; temperature; relieve; compressive; significantly; softening; maximum; preferably; 650; degree; value; expected; behavior; materials; amorphous diamond; carbon film; diamond film; compressive stress; annealing temperature; specific atomic; relieved amorphous; coordinated carbon; /427/

Citation Formats


                    Friedmann, Thomas A, and Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film.  United States: N. p., 2000. 
        Web.

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                    Friedmann, Thomas A, & Sullivan, John P. Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film.  United States.

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                    Friedmann, Thomas A, and Sullivan, John P. Sat .  
        "Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film".  United States.  https://www.osti.gov/servlets/purl/873158.

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@article{osti_873158,

  title        = {Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film},

  author       = {Friedmann, Thomas A and Sullivan, John P},

  abstractNote = {A stress-relieved amorphous-diamond film is formed by depositing an amorphous diamond film with specific atomic structure and bonding on to a substrate, and annealing the film at sufficiently high temperature to relieve the compressive stress in said film without significantly softening said film. The maximum annealing temperature is preferably on the order of 650.degree. C., a much lower value than is expected from the annealing behavior of other materials.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2000},

  month        = {1}

}

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Works referenced in this record:

Thick stress-free amorphous-tetrahedral carbon films with hardness near that of diamond
journal, December 1997

Friedmann, T. A.; Sullivan, J. P.; Knapp, J. A.
Applied Physics Letters, Vol. 71, Issue 26
https://doi.org/10.1063/1.120515

Deposition of hydrogen‐free diamond‐like carbon film by plasma enhanced chemical vapor deposition
journal, June 1996

Park, Kyu Chang; Moon, Jong Hyun; Jang, Jin
Applied Physics Letters, Vol. 68, Issue 25
https://doi.org/10.1063/1.116648

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Similar Records

Title: Method of forming a stress relieved amorphous tetrahedrally-coordinated carbon film

Abstract

Citation Formats

Thick stress-free amorphous-tetrahedral carbon films with hardness near that of diamond journal, December 1997

Deposition of hydrogen‐free diamond‐like carbon film by plasma enhanced chemical vapor deposition journal, June 1996

Thick stress-free amorphous-tetrahedral carbon films with hardness near that of diamond
journal, December 1997

Deposition of hydrogen‐free diamond‐like carbon film by plasma enhanced chemical vapor deposition
journal, June 1996