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Title: Method for maskless lithography

Abstract

The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides.

Inventors:
 [1];  [2]
  1. (13027 Arrovo de Vista, Albuquerque, NM 87111)
  2. (5258 Roxanne Ct., Livermore, Alameda County, CA 94550)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
872990
Patent Number(s):
6060224
Assignee:
Sweatt, William C. (13027 Arrovo de Vista, Albuquerque, NM 87111);Stulen, Richard H. (5258 Roxanne Ct., Livermore, Alameda County, CA 94550) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; maskless; lithography; provides; plurality; individually; addressable; rotatable; micromirrors; comprise; two-dimensional; array; micromirror; envisioned; element; picture; comprises; circuit; pattern; desired; addressed; rotates; reflect; light; source; portion; photoresist; coated; wafer; forming; pixel; electronically; addressing; proper; sequence; comprised; individual; pixels; constructed; microchip; reflecting; surface; configured; overcome; coherence; diffraction; effects; produce; elements; straight; reflect light; light source; reflecting surface; two-dimensional array; circuit pattern; circuit elements; circuit element; coated wafer; diffraction effects; individual pixels; individually addressable; maskless lithography; resist coated; rotatable micromirrors; dimensional array; diffraction effect; /430/250/359/

Citation Formats

Sweatt, William C., and Stulen, Richard H. Method for maskless lithography. United States: N. p., 2000. Web.
Sweatt, William C., & Stulen, Richard H. Method for maskless lithography. United States.
Sweatt, William C., and Stulen, Richard H. Sat . "Method for maskless lithography". United States. https://www.osti.gov/servlets/purl/872990.
@article{osti_872990,
title = {Method for maskless lithography},
author = {Sweatt, William C. and Stulen, Richard H.},
abstractNote = {The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

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