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Title: Heat pipe with improved wick structures

Abstract

An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.

Inventors:
 [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Placitas, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
872971
Patent Number(s):
6056044
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
heat; pipe; improved; wick; structures; planar; structure; projections; formed; micromachining; processes; form; arrays; interlocking; semi-closed; multiple; flow; paths; substrate; overhanging; caps; tops; increase; capillary; pumping; action; capped; stacked; layers; layer; closely; spaced; inexpensive; materials; kovar; substrates; electrodepositing; nickel; photoresist; masks; capillary pumping; flow paths; heat pipe; flow path; closely spaced; wick structure; machining process; micromachining process; multiple flow; micromachining processes; inexpensive materials; improved wick; /165/

Citation Formats

Benson, David A, Robino, Charles V, Palmer, David W, and Kravitz, Stanley H. Heat pipe with improved wick structures. United States: N. p., 2000. Web.
Benson, David A, Robino, Charles V, Palmer, David W, & Kravitz, Stanley H. Heat pipe with improved wick structures. United States.
Benson, David A, Robino, Charles V, Palmer, David W, and Kravitz, Stanley H. Sat . "Heat pipe with improved wick structures". United States. https://www.osti.gov/servlets/purl/872971.
@article{osti_872971,
title = {Heat pipe with improved wick structures},
author = {Benson, David A and Robino, Charles V and Palmer, David W and Kravitz, Stanley H},
abstractNote = {An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

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