Process for protecting bonded components from plating shorts

Tarte, Lisa A; Bonde, Wayne L; Carey, Paul G; Contolini, Robert J; McCarthy, Anthony M

Title: Process for protecting bonded components from plating shorts

Abstract

A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

Inventors:

Tarte, Lisa A ^[1]; Bonde, Wayne L ^[2]; Carey, Paul G ^[3]; Contolini, Robert J ^[2]; McCarthy, Anthony M ^[4]

Livermore, CA
Pleasanton, CA
Mountain View, CA
Menlo Park, CA

Issue Date:: 2000-01-01

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

OSTI Identifier:: 872957

Patent Number(s):: 6051493

Assignee:: Regents of University of California (Oakland, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L24/80 - {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01029 - Copper [Cu]
H01L2924/01033 - Arsenic [As]
H01L2924/01074 - Tungsten [W]
H01L2924/01078 - Platinum [Pt]
H01L2924/01079 - Gold [Au]
H01L2924/12042 - LASER
H01L2924/14 - Integrated circuits

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: process; protecting; bonded; components; plating; shorts; method; protects; region; component; substrate; electrically; insulating; fillet; photoresist; regions; subsequent; metal; shorting; plated; conductors; run; electrically insulating; /438/205/

Citation Formats


                    Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, and McCarthy, Anthony M. Process for protecting bonded components from plating shorts.  United States: N. p., 2000. 
        Web.

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                    Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, & McCarthy, Anthony M. Process for protecting bonded components from plating shorts.  United States.

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                    Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, and McCarthy, Anthony M. Sat .  
        "Process for protecting bonded components from plating shorts".  United States.  https://www.osti.gov/servlets/purl/872957.

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@article{osti_872957,

  title        = {Process for protecting bonded components from plating shorts},

  author       = {Tarte, Lisa A and Bonde, Wayne L and Carey, Paul G and Contolini, Robert J and McCarthy, Anthony M},

  abstractNote = {A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2000},

  month        = {1}

}

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Works referenced in this record:

Multichip packaging for very-high-speed digital systems
journal, December 1990

Bernhardt, A. F.; Barfknecht, A. T.; Contolini, R. J.
Applied Surface Science, Vol. 46, Issue 1-4
https://doi.org/10.1016/0169-4332(90)90130-R

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Title: Process for protecting bonded components from plating shorts

Abstract

Citation Formats

Multichip packaging for very-high-speed digital systems journal, December 1990

Multichip packaging for very-high-speed digital systems
journal, December 1990