Power electronics cooling apparatus
Abstract
A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.
- Inventors:
-
- Monroeville, PA
- Baltimore, MD
- Glen Burnie, MD
- Issue Date:
- Research Org.:
- Northrop Grumman Corp. (Los Angeles, CA)
- OSTI Identifier:
- 872821
- Patent Number(s):
- 6016007
- Assignee:
- Northrop Grumman Corp. (Los Angeles, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FC36-94GO10017
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- power; electronics; cooling; apparatus; semiconductor; arrangement; affixed; thermally; electrically; conducting; carrier; brazing; coefficient; thermal; expansion; closely; matched; operation; overstressed; mechanically; due; cycling; electrical; connection; porous; metal; heat; exchanger; connected; positioned; insulating; assembly; oil; flowing; therethrough; particularly; adapted; switching; elements; bridge; power switching; porous metal; thermal cycling; electrically insulating; thermal expansion; heat exchange; heat exchanger; electrically conducting; electrical connection; flowing therethrough; cooling apparatus; metal heat; oil flow; switching elements; thermally connected; cooling assembly; cooling arrangement; closely match; switching element; /257/
Citation Formats
Sanger, Philip Albert, Lindberg, Frank A, and Garcen, Walter. Power electronics cooling apparatus. United States: N. p., 2000.
Web.
Sanger, Philip Albert, Lindberg, Frank A, & Garcen, Walter. Power electronics cooling apparatus. United States.
Sanger, Philip Albert, Lindberg, Frank A, and Garcen, Walter. Sat .
"Power electronics cooling apparatus". United States. https://www.osti.gov/servlets/purl/872821.
@article{osti_872821,
title = {Power electronics cooling apparatus},
author = {Sanger, Philip Albert and Lindberg, Frank A and Garcen, Walter},
abstractNote = {A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jan 01 00:00:00 EST 2000},
month = {Sat Jan 01 00:00:00 EST 2000}
}
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