Title: Power electronics cooling apparatus

Abstract

A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.

Inventors:

Sanger, Philip Albert ^[1]; Lindberg, Frank A ^[2]; Garcen, Walter ^[3]

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1. Monroeville, PA
2. Baltimore, MD
3. Glen Burnie, MD

Issue Date:

2000-01-01

Research Org.:

Northrop Grumman Corp. (Los Angeles, CA)

OSTI Identifier:

872821

Patent Number(s):

6016007

Assignee:

Northrop Grumman Corp. (Los Angeles, CA)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/0603 - Bonding areas having different sizes, e.g. different heights or widths
H01L2224/48091 - Arched
H01L2224/48137 - the bodies being arranged next to each other, e.g. on a common substrate
H01L2224/48139 - with an intermediate bond, e.g. continuous wire daisy chain
H01L2224/48227 - connecting the wire to a bond pad of the item
H01L2224/4846 - with multiple bonds on the same bonding area
H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
H01L2224/49111 - the connectors connecting two common bonding areas, e.g. Litz or braid wires
H01L2224/49113 - the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
H01L2224/49175 - Parallel arrangements
H01L23/473 - by flowing liquids {
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/1305 - Bipolar Junction Transistor [BJT]
H01L2924/13055 - Insulated gate bipolar transistor [IGBT]
H01L2924/19105 - in a side-by-side arrangement on a common die mounting substrate

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DOE Contract Number:  

FC36-94GO10017

Resource Type:

Patent

Country of Publication:

United States

Language:

English

Subject:

power; electronics; cooling; apparatus; semiconductor; arrangement; affixed; thermally; electrically; conducting; carrier; brazing; coefficient; thermal; expansion; closely; matched; operation; overstressed; mechanically; due; cycling; electrical; connection; porous; metal; heat; exchanger; connected; positioned; insulating; assembly; oil; flowing; therethrough; particularly; adapted; switching; elements; bridge; power switching; porous metal; thermal cycling; electrically insulating; thermal expansion; heat exchange; heat exchanger; electrically conducting; electrical connection; flowing therethrough; cooling apparatus; metal heat; oil flow; switching elements; thermally connected; cooling assembly; cooling arrangement; closely match; switching element; /257/