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Title: Microelectromechanical gyroscope

Abstract

A gyroscope powered by an engine, all fabricated on a common substrate in the form of an integrated circuit. Preferably, both the gyroscope and the engine are fabricated in the micrometer domain, although in some embodiments of the present invention, the gyroscope can be fabricated in the millimeter domain. The engine disclosed herein provides torque to the gyroscope rotor for continuous rotation at varying speeds and direction. The present invention is preferably fabricated of polysilicon or other suitable materials on a single wafer using surface micromachining batch fabrication techniques or millimachining techniques that are well known in the art. Fabrication of the present invention is preferably accomplished without the need for assembly of multiple wafers which require alignment and bonding, and without piece-part assembly.

Inventors:
 [1]
  1. Albuquerque, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
872717
Patent Number(s):
5994801
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01C - MEASURING DISTANCES, LEVELS OR BEARINGS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
microelectromechanical; gyroscope; powered; engine; fabricated; common; substrate; form; integrated; circuit; preferably; micrometer; domain; embodiments; millimeter; disclosed; provides; torque; rotor; continuous; rotation; varying; speeds; direction; polysilicon; suitable; materials; single; wafer; surface; micromachining; batch; fabrication; techniques; millimachining; accomplished; assembly; multiple; wafers; require; alignment; bonding; piece-part; common substrate; suitable material; integrated circuit; fabrication techniques; surface micromachining; multiple wafers; suitable materials; varying speeds; micromachining batch; batch fabrication; /310/74/

Citation Formats

Garcia, Ernest J. Microelectromechanical gyroscope. United States: N. p., 1999. Web.
Garcia, Ernest J. Microelectromechanical gyroscope. United States.
Garcia, Ernest J. Fri . "Microelectromechanical gyroscope". United States. https://www.osti.gov/servlets/purl/872717.
@article{osti_872717,
title = {Microelectromechanical gyroscope},
author = {Garcia, Ernest J},
abstractNote = {A gyroscope powered by an engine, all fabricated on a common substrate in the form of an integrated circuit. Preferably, both the gyroscope and the engine are fabricated in the micrometer domain, although in some embodiments of the present invention, the gyroscope can be fabricated in the millimeter domain. The engine disclosed herein provides torque to the gyroscope rotor for continuous rotation at varying speeds and direction. The present invention is preferably fabricated of polysilicon or other suitable materials on a single wafer using surface micromachining batch fabrication techniques or millimachining techniques that are well known in the art. Fabrication of the present invention is preferably accomplished without the need for assembly of multiple wafers which require alignment and bonding, and without piece-part assembly.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

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Works referenced in this record:

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Micromechanics via x‐ray assisted processing
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