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Title: Process for metallization of a substrate by irradiative curing of a catalyst applied thereto

Abstract

An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

Inventors:
 [1];  [1];  [1]
  1. Albuquerque, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
872686
Patent Number(s):
5989653
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; metallization; substrate; irradiative; curing; catalyst; applied; thereto; improved; additive; substrates; described; whereby; solution; surface; metallic; catalytic; clusters; formed; irradiating; electroless; plating; deposit; metal; portion; additional; thickness; obtained; electrolytically; step; additional metal; additive process; electroless plating; applied thereto; substrate surface; catalyst solution; bed whereby; described whereby; /427/

Citation Formats

Chen, Ken S, Morgan, William P, and Zich, John L. Process for metallization of a substrate by irradiative curing of a catalyst applied thereto. United States: N. p., 1999. Web.
Chen, Ken S, Morgan, William P, & Zich, John L. Process for metallization of a substrate by irradiative curing of a catalyst applied thereto. United States.
Chen, Ken S, Morgan, William P, and Zich, John L. Fri . "Process for metallization of a substrate by irradiative curing of a catalyst applied thereto". United States. https://www.osti.gov/servlets/purl/872686.
@article{osti_872686,
title = {Process for metallization of a substrate by irradiative curing of a catalyst applied thereto},
author = {Chen, Ken S and Morgan, William P and Zich, John L},
abstractNote = {An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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