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Title: Automated defect spatial signature analysis for semiconductor manufacturing process

Abstract

An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.

Inventors:
 [1];  [2];  [2];  [2]
  1. (Harriman, TN)
  2. Knoxville, TN
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
OSTI Identifier:
872659
Patent Number(s):
5982920
Assignee:
Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory (Oak Ridge, TN)
Patent Classifications (CPCs):
G - PHYSICS G06 - COMPUTING G06T - IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
automated; defect; spatial; signature; analysis; semiconductor; manufacturing; process; apparatus; method; performing; alysis; data; set; representing; coordinates; wafer; processing; information; categorizing; plurality; level; categories; classifying; categorized; contained; category; user-labeled; events; correlating; classified; incipient; anomalous; condition; manufacturing process; data set; semiconductor manufacturing; signature analysis; spatial signature; performing automated; automated defect; defect spatial; data contain; /382/

Citation Formats

Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, and Sari-Sarraf, Hamed. Automated defect spatial signature analysis for semiconductor manufacturing process. United States: N. p., 1999. Web.
Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, & Sari-Sarraf, Hamed. Automated defect spatial signature analysis for semiconductor manufacturing process. United States.
Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, and Sari-Sarraf, Hamed. Fri . "Automated defect spatial signature analysis for semiconductor manufacturing process". United States. https://www.osti.gov/servlets/purl/872659.
@article{osti_872659,
title = {Automated defect spatial signature analysis for semiconductor manufacturing process},
author = {Tobin, Jr., Kenneth W. and Gleason, Shaun S and Karnowski, Thomas P and Sari-Sarraf, Hamed},
abstractNote = {An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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