Automated defect spatial signature analysis for semiconductor manufacturing process
Abstract
An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.
- Inventors:
-
- (Harriman, TN)
- Knoxville, TN
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 872659
- Patent Number(s):
- 5982920
- Assignee:
- Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
G - PHYSICS G06 - COMPUTING G06T - IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- automated; defect; spatial; signature; analysis; semiconductor; manufacturing; process; apparatus; method; performing; alysis; data; set; representing; coordinates; wafer; processing; information; categorizing; plurality; level; categories; classifying; categorized; contained; category; user-labeled; events; correlating; classified; incipient; anomalous; condition; manufacturing process; data set; semiconductor manufacturing; signature analysis; spatial signature; performing automated; automated defect; defect spatial; data contain; /382/
Citation Formats
Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, and Sari-Sarraf, Hamed. Automated defect spatial signature analysis for semiconductor manufacturing process. United States: N. p., 1999.
Web.
Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, & Sari-Sarraf, Hamed. Automated defect spatial signature analysis for semiconductor manufacturing process. United States.
Tobin, Jr., Kenneth W., Gleason, Shaun S, Karnowski, Thomas P, and Sari-Sarraf, Hamed. Fri .
"Automated defect spatial signature analysis for semiconductor manufacturing process". United States. https://www.osti.gov/servlets/purl/872659.
@article{osti_872659,
title = {Automated defect spatial signature analysis for semiconductor manufacturing process},
author = {Tobin, Jr., Kenneth W. and Gleason, Shaun S and Karnowski, Thomas P and Sari-Sarraf, Hamed},
abstractNote = {An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}