Temperature measuring device
Abstract
Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.
- Inventors:
-
- Oak Ridge, TN
- Clinton, TN
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 872599
- Patent Number(s):
- 5969639
- Assignee:
- Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01Q - ANTENNAS, i.e. RADIO AERIALS
- DOE Contract Number:
- AC04-76
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- temperature; measuring; device; systems; methods; described; wireless; instrumented; silicon; wafer; measure; temperatures; various; transmit; readings; external; receiver; particular; utility; processing; semiconductor; wafers; map; thermal; uniformity; hot; plates; cold; spin; bowl; chucks; etc; inconvenience; wires; inevitable; perturbations; attendant; semiconductor wafers; temperature measuring; semiconductor wafer; measuring device; silicon wafer; particular utility; temperature reading; cold plates; cold plate; measure temperature; /340/342/
Citation Formats
Lauf, Robert J, Bible, Don W, and Sohns, Carl W. Temperature measuring device. United States: N. p., 1999.
Web.
Lauf, Robert J, Bible, Don W, & Sohns, Carl W. Temperature measuring device. United States.
Lauf, Robert J, Bible, Don W, and Sohns, Carl W. Fri .
"Temperature measuring device". United States. https://www.osti.gov/servlets/purl/872599.
@article{osti_872599,
title = {Temperature measuring device},
author = {Lauf, Robert J and Bible, Don W and Sohns, Carl W},
abstractNote = {Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}
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