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Title: High density electronic circuit and process for making

Abstract

High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing.

Inventors:
 [1]
  1. Albuquerque, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
872364
Patent Number(s):
5918153
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
density; electronic; circuit; process; circuits; posts; protrude; surface; substrate; provide; easy; mounting; devices; integrated; stress; relief; accommodate; differential; thermal; expansion; allows; interconnect; fewer; alignment; restrictions; wasted; previous; processes; resulting; substrates; platforms; die; testing; multi-chip; module; platform; contain; active; components; emulate; realistic; operational; conditions; replacing; shorts; net; differential thermal; electronic circuit; thermal expansion; integrated circuits; integrated circuit; process allows; active components; stress relief; multi-chip module; provide easy; active component; /438/174/361/

Citation Formats

Morgan, William P. High density electronic circuit and process for making. United States: N. p., 1999. Web.
Morgan, William P. High density electronic circuit and process for making. United States.
Morgan, William P. Fri . "High density electronic circuit and process for making". United States. https://www.osti.gov/servlets/purl/872364.
@article{osti_872364,
title = {High density electronic circuit and process for making},
author = {Morgan, William P},
abstractNote = {High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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