Maskless lithography
Abstract
The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides.
- Inventors:
-
- Albuquerque, NM
- Livermore, CA
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 872145
- Patent Number(s):
- 5870176
- Assignee:
- Sandia Corporation (Livermore, CA)
- Patent Classifications (CPCs):
-
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- maskless; lithography; provides; method; plurality; individually; addressable; rotatable; micromirrors; comprise; two-dimensional; array; micromirror; envisioned; element; picture; comprises; circuit; pattern; desired; addressed; rotates; reflect; light; source; portion; photoresist; coated; wafer; forming; pixel; electronically; addressing; proper; sequence; comprised; individual; pixels; constructed; microchip; reflecting; surface; configured; overcome; coherence; diffraction; effects; produce; elements; straight; reflect light; light source; reflecting surface; two-dimensional array; circuit pattern; circuit elements; circuit element; coated wafer; diffraction effects; individual pixels; individually addressable; maskless lithography; resist coated; rotatable micromirrors; dimensional array; diffraction effect; /355/250/347/359/
Citation Formats
Sweatt, William C, and Stulen, Richard H. Maskless lithography. United States: N. p., 1999.
Web.
Sweatt, William C, & Stulen, Richard H. Maskless lithography. United States.
Sweatt, William C, and Stulen, Richard H. Fri .
"Maskless lithography". United States. https://www.osti.gov/servlets/purl/872145.
@article{osti_872145,
title = {Maskless lithography},
author = {Sweatt, William C and Stulen, Richard H},
abstractNote = {The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}