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Title: Electroless copper plating

Abstract

An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.

Inventors:
 [1]
  1. (Lee's Summit, MO)
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
OSTI Identifier:
872041
Patent Number(s):
5849355
Application Number:
08/717,195
Assignee:
AlliedSignal Inc. (Morristown, NJ) KCP
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electroless; copper; plating; optimized; technique; suitable; ceramics; electroless copper; copper plating; /427/29/333/

Citation Formats

McHenry, Michael R. Electroless copper plating. United States: N. p., 1998. Web.
McHenry, Michael R. Electroless copper plating. United States.
McHenry, Michael R. Tue . "Electroless copper plating". United States. https://www.osti.gov/servlets/purl/872041.
@article{osti_872041,
title = {Electroless copper plating},
author = {McHenry, Michael R.},
abstractNote = {An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {12}
}

Patent:

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