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Title: Solderability test system

Abstract

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

Inventors:
 [1];  [2];  [2];  [3];  [3];  [4]
  1. (Cedar Crest, NM)
  2. (Albuquerque, NM)
  3. (Beverly, MA)
  4. (Austin, TX)
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
871937
Patent Number(s):
5827951
Assignee:
Sandia National Laboratories (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
solderability; method; quantify; capillary; flow; printed; wiring; board; surface; finish; based; solder; pad; narrow; strips; lines; procedure; video; image; analysis; technique; developed; conducting; evaluating; data; feasibility; tests; revealed; wetted; distance; sensitive; ratio; radius; line; width; volume; flux; predry; time; surface finish; video image; printed wiring; analysis technique; narrow strip; line width; wiring board; image analysis; capillary flow; /73/228/

Citation Formats

Yost, Fred, Hosking, Floyd M., Jellison, James L., Short, Bruce, Giversen, Terri, and Reed, Jimmy R. Solderability test system. United States: N. p., 1998. Web.
Yost, Fred, Hosking, Floyd M., Jellison, James L., Short, Bruce, Giversen, Terri, & Reed, Jimmy R. Solderability test system. United States.
Yost, Fred, Hosking, Floyd M., Jellison, James L., Short, Bruce, Giversen, Terri, and Reed, Jimmy R. Thu . "Solderability test system". United States. https://www.osti.gov/servlets/purl/871937.
@article{osti_871937,
title = {Solderability test system},
author = {Yost, Fred and Hosking, Floyd M. and Jellison, James L. and Short, Bruce and Giversen, Terri and Reed, Jimmy R.},
abstractNote = {A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}

Patent:

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