Solderability test system

Title: Solderability test system

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Abstract

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

Inventors:

Yost, Fred ^[1]; Hosking, Floyd M ^[2]; Jellison, James L ^[2]; Short, Bruce ^[3]; Giversen, Terri ^[3]; Reed, Jimmy R ^[4]

Cedar Crest, NM
Albuquerque, NM
Beverly, MA
Austin, TX

Issue Date:: 1998-01-01

Research Org.:: AT&T

OSTI Identifier:: 871937

Patent Number(s):: 5827951

Assignee:: Sandia National Laboratories (Albuquerque, NM)

Patent Classifications (CPCs):: G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

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G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
G01N13/00 - Investigating surface or boundary effects, e.g. wetting power

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K2101/40 - Semiconductor devices
B23K31/02 - relating to soldering or welding

G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
G01N2013/0225 - {of liquid metals or solder}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0269 - {for visual or optical inspection}
H05K3/3457 - {Solder materials or compositions
H05K2201/09781 - Dummy conductors, i.e. not used for normal transport of current
H05K2203/163 - Monitoring a manufacturing process
H05K2203/043 - Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

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DOE Contract Number:: AC04-76DP00789

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: solderability; method; quantify; capillary; flow; printed; wiring; board; surface; finish; based; solder; pad; narrow; strips; lines; procedure; video; image; analysis; technique; developed; conducting; evaluating; data; feasibility; tests; revealed; wetted; distance; sensitive; ratio; radius; line; width; volume; flux; predry; time; surface finish; video image; printed wiring; analysis technique; narrow strip; line width; wiring board; image analysis; capillary flow; /73/228/

Citation Formats


                    Yost, Fred, Hosking, Floyd M, Jellison, James L, Short, Bruce, Giversen, Terri, and Reed, Jimmy R. Solderability test system.  United States: N. p., 1998. 
        Web.

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                    Yost, Fred, Hosking, Floyd M, Jellison, James L, Short, Bruce, Giversen, Terri, & Reed, Jimmy R. Solderability test system.  United States.

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                    Yost, Fred, Hosking, Floyd M, Jellison, James L, Short, Bruce, Giversen, Terri, and Reed, Jimmy R. Thu .  
        "Solderability test system".  United States.  https://www.osti.gov/servlets/purl/871937.

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@article{osti_871937,

  title        = {Solderability test system},

  author       = {Yost, Fred and Hosking, Floyd M and Jellison, James L and Short, Bruce and Giversen, Terri and Reed, Jimmy R},

  abstractNote = {A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1998},

  month        = {1}

}

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