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Title: Adhesive bonding using variable frequency microwave energy

Abstract

Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

Inventors:
 [1];  [2];  [1];  [3];  [4]
  1. (Oak Ridge, TN)
  2. (Knoxville, TN)
  3. (Cary, NC)
  4. (Raleigh, NC)
Issue Date:
Research Org.:
LOCKHEED MARTIN ENRGY SYST INC
OSTI Identifier:
871798
Patent Number(s):
5798395
Assignee:
Lambda Technologies Inc. (Raleigh, NC); Lockheed Martin Energy Research Corporation (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
adhesive; bonding; variable; frequency; microwave; energy; methods; facilitating; various; components; disclosed; time; required; cure; polymeric; decreased; placing; bonded; via; heating; apparatus; multimode; cavity; irradiated; microwaves; varying; frequencies; uniformly; articles; conductive; fibers; disposed; therein; provided; selectively; oriented; enter; edge; portion; article; shielded; adhesive bonding; time required; conductive fibers; frequency microwave; variable frequency; microwave energy; disposed therein; microwave heating; various components; edge portion; wave energy; heating apparatus; polymeric adhesive; fibers therein; uniformly heat; adhesive bond; various component; /522/156/204/219/

Citation Formats

Lauf, Robert J., McMillan, April D., Paulauskas, Felix L., Fathi, Zakaryae, and Wei, Jianghua. Adhesive bonding using variable frequency microwave energy. United States: N. p., 1998. Web.
Lauf, Robert J., McMillan, April D., Paulauskas, Felix L., Fathi, Zakaryae, & Wei, Jianghua. Adhesive bonding using variable frequency microwave energy. United States.
Lauf, Robert J., McMillan, April D., Paulauskas, Felix L., Fathi, Zakaryae, and Wei, Jianghua. Thu . "Adhesive bonding using variable frequency microwave energy". United States. https://www.osti.gov/servlets/purl/871798.
@article{osti_871798,
title = {Adhesive bonding using variable frequency microwave energy},
author = {Lauf, Robert J. and McMillan, April D. and Paulauskas, Felix L. and Fathi, Zakaryae and Wei, Jianghua},
abstractNote = {Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}

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