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Title: Method for integrating microelectromechanical devices with electronic circuitry

Abstract

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

Inventors:
 [1];  [1];  [1];  [1]
  1. Albuquerque, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
871797
Patent Number(s):
5798283
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
G - PHYSICS G01 - MEASURING G01P - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; integrating; microelectromechanical; devices; electronic; circuitry; comprises; steps; forming; device; cavity; below; surface; substrate; encapsulating; prior; releasing; operation; fabrication; planarization; encapsulated; formation; allows; standard; processing; microelectromechanical devices; device surface; electronic circuit; method comprises; electronic circuitry; processing steps; mechanical device; standard processing; processing step; method comprise; forming electronic; integrating microelectromechanical; electromechanical devices; mechanical devices; microelectromechanical device; /438/

Citation Formats

Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States: N. p., 1998. Web.
Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, & McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States.
Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Thu . "Method for integrating microelectromechanical devices with electronic circuitry". United States. https://www.osti.gov/servlets/purl/871797.
@article{osti_871797,
title = {Method for integrating microelectromechanical devices with electronic circuitry},
author = {Montague, Stephen and Smith, James H and Sniegowski, Jeffry J and McWhorter, Paul J},
abstractNote = {A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 1998},
month = {Thu Jan 01 00:00:00 EST 1998}
}

Works referenced in this record:

A surface micromachined silicon accelerometer with on-chip detection circuitry
journal, October 1994


Polysilicon integrated microsystems: technologies and applications
journal, August 1996


A smart accelerometer with on-chip electronics fabricated by a commercial CMOS process
journal, March 1992