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Title: Heat pipe with embedded wick structure

Abstract

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

Inventors:
 [1];  [1];  [1];  [1];  [2]
  1. (Albuquerque, NM)
  2. (Corrales, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
871638
Patent Number(s):
5769154
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
heat; pipe; embedded; wick; structure; maximizes; capillary; pumping; capability; attached; devices; integrated; circuits; evaporates; fluid; vapor; cools; condenses; dissipation; surface; condensate; collects; returns; capillary pumping; heat pipe; integrated circuits; integrated circuit; heat dissipation; wick structure; embedded wick; pumping capability; circuits evaporates; vapor cools; attached devices; maximizes capillary; /165/126/

Citation Formats

Adkins, Douglas Ray, Shen, David S., Tuck, Melanie R., Palmer, David W., and Grafe, V. Gerald. Heat pipe with embedded wick structure. United States: N. p., 1998. Web.
Adkins, Douglas Ray, Shen, David S., Tuck, Melanie R., Palmer, David W., & Grafe, V. Gerald. Heat pipe with embedded wick structure. United States.
Adkins, Douglas Ray, Shen, David S., Tuck, Melanie R., Palmer, David W., and Grafe, V. Gerald. Thu . "Heat pipe with embedded wick structure". United States. https://www.osti.gov/servlets/purl/871638.
@article{osti_871638,
title = {Heat pipe with embedded wick structure},
author = {Adkins, Douglas Ray and Shen, David S. and Tuck, Melanie R. and Palmer, David W. and Grafe, V. Gerald},
abstractNote = {A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}

Patent:

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