Toughened epoxy resin system and a method thereof
Abstract
Mixtures of epoxy resins with cationic initiators are curable under high energy ionizing radiation such as electron beam radiation, X-ray radiation, and gamma radiation. The composition of this process consists of an epoxy resin, a cationic initiator such as a diaryliodonium or triarylsulfonium salt of specific anions, and a toughening agent such as a thermoplastic, hydroxy-containing thermoplastic oligomer, epoxy-containing thermoplastic oligomer, reactive flexibilizer, rubber, elastomer, or mixture thereof. Cured compositions have high glass transition temperatures, good mechanical properties, and good toughness. These properties are comparable to those of similar thermally cured epoxies.
- Inventors:
-
- Oliver Springs, TN
- Farragut, TN
- Knoxville, TN
- Manitoba, CA
- Issue Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 871412
- Patent Number(s):
- 5726216
- Assignee:
- Lockheed Martin Energy Systems, Inc. (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08L - COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- toughened; epoxy; resin; method; mixtures; resins; cationic; initiators; curable; energy; ionizing; radiation; electron; beam; x-ray; gamma; composition; process; consists; initiator; diaryliodonium; triarylsulfonium; salt; specific; anions; toughening; agent; thermoplastic; hydroxy-containing; oligomer; epoxy-containing; reactive; flexibilizer; rubber; elastomer; mixture; cured; compositions; glass; transition; temperatures; mechanical; properties; toughness; comparable; similar; thermally; epoxies; electron beam; mechanical properties; ionizing radiation; gamma radiation; transition temperature; x-ray radiation; glass transition; epoxy resin; toughening agent; beam radiation; ray radiation; epoxy resins; transition temperatures; process consists; energy ionizing; /522/528/
Citation Formats
Janke, Christopher J, Dorsey, George F, Havens, Stephen J, and Lopata, Vincent J. Toughened epoxy resin system and a method thereof. United States: N. p., 1998.
Web.
Janke, Christopher J, Dorsey, George F, Havens, Stephen J, & Lopata, Vincent J. Toughened epoxy resin system and a method thereof. United States.
Janke, Christopher J, Dorsey, George F, Havens, Stephen J, and Lopata, Vincent J. Tue .
"Toughened epoxy resin system and a method thereof". United States. https://www.osti.gov/servlets/purl/871412.
@article{osti_871412,
title = {Toughened epoxy resin system and a method thereof},
author = {Janke, Christopher J and Dorsey, George F and Havens, Stephen J and Lopata, Vincent J},
abstractNote = {Mixtures of epoxy resins with cationic initiators are curable under high energy ionizing radiation such as electron beam radiation, X-ray radiation, and gamma radiation. The composition of this process consists of an epoxy resin, a cationic initiator such as a diaryliodonium or triarylsulfonium salt of specific anions, and a toughening agent such as a thermoplastic, hydroxy-containing thermoplastic oligomer, epoxy-containing thermoplastic oligomer, reactive flexibilizer, rubber, elastomer, or mixture thereof. Cured compositions have high glass transition temperatures, good mechanical properties, and good toughness. These properties are comparable to those of similar thermally cured epoxies.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {3}
}
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Works referenced in this record:
The electron beam-induced cationic polymerization of epoxy resins
journal, January 1992
- Crivello, James V.; Fan, Mingxin; Bi, Daoshen
- Journal of Applied Polymer Science, Vol. 44, Issue 1
Radiation curing of an epoxy-acrylate-6,7-epoxy-3,7-dimethyloctyl acrylate
journal, April 1991
- Batten, Richard J.; Davidson, R. Stephen; Wilkinson, Susan A.
- Journal of Photochemistry and Photobiology A: Chemistry, Vol. 58, Issue 1
Electron-beam-induced polymerization of epoxides
journal, April 1991
- Stephen Davidson, R.; Wilkinson, Susan A.
- Journal of Photochemistry and Photobiology A: Chemistry, Vol. 58, Issue 1
New High‐Resolution and High‐Sensitivity Deep UV, X‐Ray, and Electron‐Beam Resists
journal, April 1991
- Hatzakis, M.; Stewart, K. J.; Shaw, J. M.
- Journal of The Electrochemical Society, Vol. 138, Issue 4
Electron beam curing of bisphenol A epoxy resins. [ビスフェノールＡ型エポキシ樹脂の電子線硬化]
journal, January 1987
- Okada, Toshio; Asano, Tsutomu; Hatada, Motoyoshi
- KOBUNSHI RONBUNSHU, Vol. 44, Issue 10
Plasticization and antiplasticization effects of sulphonium salt initiator fragments remaining in cycloaliphatic epoxy resins cured by electron beam and ultraviolet irradiation
journal, January 1992
- Udagawa, Atsushi; Yamamoto, Yasuhiko; Inoue, Yoshio
- Polymer, Vol. 33, Issue 2
New high resolution and high sensitivity deep UV, x-ray, and electron beam resists
journal, April 1990
- Hatzakis, Michael; Stewart, Kevin J.; Shaw, Jane M.
- Microelectronic Engineering, Vol. 11, Issue 1-4
Application of a new analytical technique of electron distribution calculations to the profile simulation of a high sensitivity negative electron-beam resist
journal, November 1992
- Glezos, N.
- Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 10, Issue 6
Chemistry & technology of UV & EB formulation for coatings, Inks & paints. Vol. 5: Speciality finishes
journal, January 1995
- Comyn, J.
- International Journal of Adhesion and Adhesives, Vol. 15, Issue 1
Simple negative resist for deep ultraviolet, electron beam, and x-ray lithography
journal, November 1989
- Stewart, K. J.
- Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 7, Issue 6