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Title: Pressure activated diaphragm bonder

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.
 [1];  [2]
  1. (Antioch, CA)
  2. (Livermore, CA)
Issue Date:
OSTI Identifier:
Regents of University of California (Oakland, CA) LLNL
Patent Number(s):
US 5632434
Contract Number:
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Country of Publication:
United States
pressure; activated; diaphragm; bonder; device; available; bonding; component; particularly; electronic; components; integrated; circuits; chips; substrate; embodiment; bottom; metal; block; machined; located; template; openings; match; solder; patterns; placed; positioned; therein; top; secured; retained; therebetween; countersink; portion; extends; inert; gas; supplied; exert; uniform; distribution; soldering; heating; means; provided; melt; thereto; pressure distribution; heating means; openings therein; inert gas; integrated circuits; integrated circuit; electronic components; bottom block; metal block; uniform pressure; pressure activated; /228/156/