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Title: Pressure activated diaphragm bonder

Abstract

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

Inventors:
 [1];  [2]
  1. Antioch, CA
  2. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
870965
Patent Number(s):
5632434
Assignee:
Regents of University of California (Oakland, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
pressure; activated; diaphragm; bonder; device; available; bonding; component; particularly; electronic; components; integrated; circuits; chips; substrate; embodiment; bottom; metal; block; machined; located; template; openings; match; solder; patterns; placed; positioned; therein; top; secured; retained; therebetween; countersink; portion; extends; inert; gas; supplied; exert; uniform; distribution; soldering; heating; means; provided; melt; thereto; pressure distribution; heating means; openings therein; inert gas; integrated circuits; integrated circuit; electronic components; bottom block; metal block; uniform pressure; pressure activated; /228/156/

Citation Formats

Evans, Leland B, and Malba, Vincent. Pressure activated diaphragm bonder. United States: N. p., 1997. Web.
Evans, Leland B, & Malba, Vincent. Pressure activated diaphragm bonder. United States.
Evans, Leland B, and Malba, Vincent. Wed . "Pressure activated diaphragm bonder". United States. https://www.osti.gov/servlets/purl/870965.
@article{osti_870965,
title = {Pressure activated diaphragm bonder},
author = {Evans, Leland B and Malba, Vincent},
abstractNote = {A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1997},
month = {1}
}

Patent:

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