On-clip high frequency reliability and failure test structures
Abstract
Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 870926
- Patent Number(s):
- 5625288
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- on-clip; frequency; reliability; failure; structures; self-stressing; realistic; characterizations; on-chip; oscillator; controlled; dc; signals; off-chip; provides; range; pulses; provide; information; regard; variety; mechanisms; including; hot-carriers; electromigration; oxide; breakdown; normally; integrated; wafer; level; predict; production; circuits; integrated circuits; integrated circuit; provide information; frequency pulses; failure mechanisms; including hot; frequency reliability; frequency oscillator; frequency pulse; dc signal; /324/
Citation Formats
Snyder, Eric S, and Campbell, David V. On-clip high frequency reliability and failure test structures. United States: N. p., 1997.
Web.
Snyder, Eric S, & Campbell, David V. On-clip high frequency reliability and failure test structures. United States.
Snyder, Eric S, and Campbell, David V. Wed .
"On-clip high frequency reliability and failure test structures". United States. https://www.osti.gov/servlets/purl/870926.
@article{osti_870926,
title = {On-clip high frequency reliability and failure test structures},
author = {Snyder, Eric S and Campbell, David V},
abstractNote = {Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1997},
month = {1}
}
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