Retractable pin dual in-line package test clip

Bandzuch, Gregory S; Kosslow, William J

Title: Retractable pin dual in-line package test clip

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Abstract

This invention is a Dual In-Line Package (DIP) test clip for use when troubleshooting circuits containing DIP integrated circuits. This test clip is a significant improvement over existing DIP test clips in that it has retractable pins which will permit troubleshooting without risk of accidentally shorting adjacent pins together when moving probes to different pins on energized circuits or when the probe is accidentally bumped while taking measurements.

Inventors:

Bandzuch, Gregory S ^[1]; Kosslow, William J ^[2]

Washington, PA
Jefferson Boro, PA

Issue Date:: 1996-01-01

OSTI Identifier:: 870462

Patent Number(s):: 5525812

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Classifications (CPCs):: G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS

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G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES
G01R1/0425 - {Test clips, e.g. for IC's}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
H01R11/24 - with gripping jaws, e.g. crocodile clip
H01R31/06 - Intermediate parts for linking two coupling parts, e.g. adapter

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/53217 - Means to simultaneously assemble multiple, independent conductors to terminal
Y10T29/53257 - Means comprising hand-manipulatable implement

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Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: retractable; dual; in-line; package; clip; dip; troubleshooting; circuits; containing; integrated; significant; improvement; existing; clips; pins; permit; risk; accidentally; shorting; adjacent; moving; probes; energized; probe; bumped; taking; measurements; integrated circuits; integrated circuit; significant improvement; in-line package; dual in-line; /257/29/422/

Citation Formats


                    Bandzuch, Gregory S, and Kosslow, William J. Retractable pin dual in-line package test clip.  United States: N. p., 1996. 
        Web.

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                    Bandzuch, Gregory S, & Kosslow, William J. Retractable pin dual in-line package test clip.  United States.

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                    Bandzuch, Gregory S, and Kosslow, William J. Mon .  
        "Retractable pin dual in-line package test clip".  United States.  https://www.osti.gov/servlets/purl/870462.

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@article{osti_870462,

  title        = {Retractable pin dual in-line package test clip},

  author       = {Bandzuch, Gregory S and Kosslow, William J},

  abstractNote = {This invention is a Dual In-Line Package (DIP) test clip for use when troubleshooting circuits containing DIP integrated circuits. This test clip is a significant improvement over existing DIP test clips in that it has retractable pins which will permit troubleshooting without risk of accidentally shorting adjacent pins together when moving probes to different pins on energized circuits or when the probe is accidentally bumped while taking measurements.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1996},

  month        = {1}

}

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