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Title: Molecular assemblies as protective barriers and adhesion promotion interlayer

Abstract

A protective diffusion barrier having adhesive qualifies for metalized surfaces is provided by a passivating agent having the formula HS--(CH.sub.2).sub.11 --COOH Which forms a very dense, transparent organized molecular assembly or layer that is impervious to water, alkali, and other impurities and corrosive substances that typically attack metal surfaces.

Inventors:
 [1];  [2];  [3]
  1. Lakewood, CO
  2. Denver, CO
  3. Lafayette, CO
Issue Date:
Research Org.:
Midwest Research Institute, Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
870272
Patent Number(s):
5487792
Assignee:
Midwest Research Institute (Kansas City, MO)
Patent Classifications (CPCs):
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC02-83CH10093
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
molecular; assemblies; protective; barriers; adhesion; promotion; interlayer; diffusion; barrier; adhesive; qualifies; metalized; surfaces; provided; passivating; agent; formula; hs-; 11; -cooh; forms; dense; transparent; organized; assembly; layer; impervious; water; alkali; impurities; corrosive; substances; typically; attack; metal; diffusion barrier; metal surface; metal surfaces; protective diffusion; typically attack; protective barrier; protective barriers; corrosive substances; /136/106/148/359/427/428/438/

Citation Formats

King, David E, Czanderna, Alvin W, and Kennedy, Cheryl E. Molecular assemblies as protective barriers and adhesion promotion interlayer. United States: N. p., 1996. Web.
King, David E, Czanderna, Alvin W, & Kennedy, Cheryl E. Molecular assemblies as protective barriers and adhesion promotion interlayer. United States.
King, David E, Czanderna, Alvin W, and Kennedy, Cheryl E. Mon . "Molecular assemblies as protective barriers and adhesion promotion interlayer". United States. https://www.osti.gov/servlets/purl/870272.
@article{osti_870272,
title = {Molecular assemblies as protective barriers and adhesion promotion interlayer},
author = {King, David E and Czanderna, Alvin W and Kennedy, Cheryl E},
abstractNote = {A protective diffusion barrier having adhesive qualifies for metalized surfaces is provided by a passivating agent having the formula HS--(CH.sub.2).sub.11 --COOH Which forms a very dense, transparent organized molecular assembly or layer that is impervious to water, alkali, and other impurities and corrosive substances that typically attack metal surfaces.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}

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Works referenced in this record:

Thin film characteristics of fluorine-substituted monolayers prepared by chemical adsorption from solution
journal, August 1993


Orientation and chemistry of alkyl thiolates on the Ni(100) surface
journal, August 1993


Bonding of vapor deposited gold to glass using organosilane primers
journal, January 1987


Self-assembled monolayers of n-alkanethiolates on copper are barrier films that protect the metal against oxidation by air
journal, November 1992


Self‐Assembled Layers of Alkanethiols on Copper for Protection Against Corrosion
journal, February 1993