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Title: Solar cell array interconnects

Abstract

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

Inventors:
 [1];  [2];  [3];  [3]
  1. Mountain View, CA
  2. Brentwood, CA
  3. Livermore, CA
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
870154
Patent Number(s):
5466302
Assignee:
Regents of University of California (Oakland, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
solar; cell; array; interconnects; electrical; cells; electronic; components; silver-silicone; paste; lead-tin; pb-sn; no-clean; fluxless; solder; cream; whereby; breakage; mil; thick; conventional; interconnect; eliminated; employs; copper; strips; secured; conductive; temperature; eliminates; undesired; residue; active; surfaces; testing; shown; degradation; developed; current; providing; contact; resistance; value; solar cell; solar cells; active surface; contact resistance; electronic components; cell array; mil thick; resistance value; electrical interconnects; active surfaces; electrical interconnect; conductive paste; current testing; /136/228/438/

Citation Formats

Carey, Paul G, Thompson, Jesse B, Colella, Nicolas J, and Williams, Kenneth A. Solar cell array interconnects. United States: N. p., 1995. Web.
Carey, Paul G, Thompson, Jesse B, Colella, Nicolas J, & Williams, Kenneth A. Solar cell array interconnects. United States.
Carey, Paul G, Thompson, Jesse B, Colella, Nicolas J, and Williams, Kenneth A. Sun . "Solar cell array interconnects". United States. https://www.osti.gov/servlets/purl/870154.
@article{osti_870154,
title = {Solar cell array interconnects},
author = {Carey, Paul G and Thompson, Jesse B and Colella, Nicolas J and Williams, Kenneth A},
abstractNote = {Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}

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