Tin-silver-bismuth solders for electronics assembly
Abstract
A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 870014
- Patent Number(s):
- 5439639
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- tin-silver-bismuth; solders; electronics; assembly; lead-free; solder; alloy; electronic; assemblies; composed; eutectic; silver; bismuth; addition; percent; weight; based; effective; depress; melting; tin-silver; composition; desired; level; ranges; 218; degree; 205; depending; amount; added; determined; dsc; analysis; 10; preferred; 91; 84sn-3; 33ag-4; 83bi; total; percent based; desired level; alloy composition; weight percent; weight based; preferred alloy; silver alloy; eutectic alloy; solder alloy; lead-free solder; /420/148/
Citation Formats
Vianco, Paul T, and Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly. United States: N. p., 1995.
Web.
Vianco, Paul T, & Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly. United States.
Vianco, Paul T, and Rejent, Jerome A. Sun .
"Tin-silver-bismuth solders for electronics assembly". United States. https://www.osti.gov/servlets/purl/870014.
@article{osti_870014,
title = {Tin-silver-bismuth solders for electronics assembly},
author = {Vianco, Paul T and Rejent, Jerome A},
abstractNote = {A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.