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Title: Tin-silver-bismuth solders for electronics assembly

Abstract

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

Inventors:
 [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
AT & T CORP
OSTI Identifier:
870014
Patent Number(s):
5439639
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
tin-silver-bismuth; solders; electronics; assembly; lead-free; solder; alloy; electronic; assemblies; composed; eutectic; silver; bismuth; addition; percent; weight; based; effective; depress; melting; tin-silver; composition; desired; level; ranges; 218; degree; 205; depending; amount; added; determined; dsc; analysis; 10; preferred; 91; 84sn-3; 33ag-4; 83bi; total; percent based; desired level; alloy composition; weight percent; weight based; preferred alloy; silver alloy; eutectic alloy; solder alloy; lead-free solder; /420/148/

Citation Formats

Vianco, Paul T., and Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly. United States: N. p., 1995. Web.
Vianco, Paul T., & Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly. United States.
Vianco, Paul T., and Rejent, Jerome A. Sun . "Tin-silver-bismuth solders for electronics assembly". United States. https://www.osti.gov/servlets/purl/870014.
@article{osti_870014,
title = {Tin-silver-bismuth solders for electronics assembly},
author = {Vianco, Paul T. and Rejent, Jerome A.},
abstractNote = {A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}

Patent:

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