Tin-silver-bismuth solders for electronics assembly

Vianco, Paul T; Rejent, Jerome A

Title: Tin-silver-bismuth solders for electronics assembly

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Abstract

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

Inventors:

Vianco, Paul T ^[1]; Rejent, Jerome A ^[1]

Albuquerque, NM

Issue Date:: 1995-01-01

Research Org.:: AT&T

OSTI Identifier:: 870014

Patent Number(s):: 5439639

Assignee:: Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K35/262 - {Sn as the principal constituent}

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DOE Contract Number:: AC04-76DP00789

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: tin-silver-bismuth; solders; electronics; assembly; lead-free; solder; alloy; electronic; assemblies; composed; eutectic; silver; bismuth; addition; percent; weight; based; effective; depress; melting; tin-silver; composition; desired; level; ranges; 218; degree; 205; depending; amount; added; determined; dsc; analysis; 10; preferred; 91; 84sn-3; 33ag-4; 83bi; total; percent based; desired level; alloy composition; weight percent; weight based; preferred alloy; silver alloy; eutectic alloy; solder alloy; lead-free solder; /420/148/

Citation Formats


                    Vianco, Paul T, and Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly.  United States: N. p., 1995. 
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                    Vianco, Paul T, & Rejent, Jerome A. Tin-silver-bismuth solders for electronics assembly.  United States.

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                    Vianco, Paul T, and Rejent, Jerome A. Sun .  
        "Tin-silver-bismuth solders for electronics assembly".  United States.  https://www.osti.gov/servlets/purl/870014.

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@article{osti_870014,

  title        = {Tin-silver-bismuth solders for electronics assembly},

  author       = {Vianco, Paul T and Rejent, Jerome A},

  abstractNote = {A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1995},

  month        = {1}

}

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