Apparatus and method for measuring the thickness of a semiconductor wafer
Abstract
Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.
- Inventors:
-
- 31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439
- Issue Date:
- Research Org.:
- Midwest Research Institute, Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 869781
- Patent Number(s):
- 5396332
- Assignee:
- Ciszek, Theodoer F. (31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01B - MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS
- DOE Contract Number:
- AC02-83CH10093
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- apparatus; method; measuring; thickness; semiconductor; wafer; thicknesses; wafers; comprising; housing; means; supporting; light-tight; environment; light; source; mounted; emit; predetermined; wavelength; normally; impinge; detector; supported; distance; opposite; impinges; adapted; receive; transmitted; semiconductor wafers; transmitted light; housing means; predetermined wavelength; semiconductor wafer; light source; predetermined distance; light detector; receive light; light transmitted; emit light; source mounted; measuring thickness; /356/250/
Citation Formats
Ciszek, Theodoer F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States: N. p., 1995.
Web.
Ciszek, Theodoer F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States.
Ciszek, Theodoer F. Sun .
"Apparatus and method for measuring the thickness of a semiconductor wafer". United States. https://www.osti.gov/servlets/purl/869781.
@article{osti_869781,
title = {Apparatus and method for measuring the thickness of a semiconductor wafer},
author = {Ciszek, Theodoer F},
abstractNote = {Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}
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