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Title: Apparatus and method for measuring the thickness of a semiconductor wafer

Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.
Inventors:
 [1]
  1. (31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439)
Issue Date:
OSTI Identifier:
869781
Assignee:
Ciszek, Theodoer F. (31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439) CHO
Patent Number(s):
US 5396332
Contract Number:
AC02-83CH10093
Research Org:
MIDWEST RESEARCH INSTITUTE
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
apparatus; method; measuring; thickness; semiconductor; wafer; thicknesses; wafers; comprising; housing; means; supporting; light-tight; environment; light; source; mounted; emit; predetermined; wavelength; normally; impinge; detector; supported; distance; opposite; impinges; adapted; receive; transmitted; semiconductor wafers; transmitted light; housing means; predetermined wavelength; semiconductor wafer; light source; predetermined distance; light detector; receive light; light transmitted; emit light; source mounted; measuring thickness; /356/250/

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