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Title: Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell

Abstract

A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. Themore » electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.« less

Inventors:
 [1];  [1]
  1. Monroeville, PA
Issue Date:
Research Org.:
Westinghouse Electric Corporation (Pittsburgh, PA)
OSTI Identifier:
869754
Patent Number(s):
5391440
Assignee:
Westinghouse Electric Corporation (Pittsburgh, PA)
DOE Contract Number:  
FC21-91MC28055
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; forming; leak; proof; plasma; sprayed; interconnection; layer; electrode; electrochemical; cell; dense; substantially; gas-tight; electrically; conductive; formed; structure; providing; selected; portion; surface; formula; 1-x; 1-y; dopant; sr; mixtures; mg; independently; 075-0; 25; thermally; spraying; preferably; flux; added; spray; powder; agglomerated; comprising; particles; including; cao; 12; lacro; undoped; form; material; bonded; single; step; heat; treating; 1200; degree; 1350; densify; heal; micro-cracks; macro-cracks; result; highly; doped; air; solid; electrolyte; applied; unselected; fuel; generation; electrical; power; substantially gas-tight; powder comprising; material bonded; interconnection layer; electrolyte layer; plasma spray; electrode structure; air electrode; electrical power; electrochemical cell; electrically conductive; solid electrolyte; plasma spraying; fuel electrode; electrode surface; heat treating; highly doped; interconnection material; conductive interconnection; selected portion; plasma sprayed; doped lacro; sprayed interconnection; articles including; thermally sprayed; preferably including; single plasma; conductive interconnect; leak proof; /429/29/427/

Citation Formats

Kuo, Lewis J. H., and Vora, Shailesh D. Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell. United States: N. p., 1995. Web.
Kuo, Lewis J. H., & Vora, Shailesh D. Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell. United States.
Kuo, Lewis J. H., and Vora, Shailesh D. Sun . "Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell". United States. https://www.osti.gov/servlets/purl/869754.
@article{osti_869754,
title = {Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell},
author = {Kuo, Lewis J. H. and Vora, Shailesh D},
abstractNote = {A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}

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