Methods for patterned deposition on a substrate
Abstract
A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 869700
- Patent Number(s):
- 5380474
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- methods; patterned; deposition; substrate; method; described; depositions; material; surface; polymeric; etched; form; layer; enhanced; adhesions; characteristics; selected; portions; removed; define; pattern; diminished; adhesion; conductor; remaining; embodiment; ptfe; chemically; improve; copper; thereto; thereafter; irradiated; laser; beam; remove; patterns; polymeric substrate; laser beam; selected portion; selected portions; adhesion characteristics; etched surface; chemically etched; enhanced adhesion; patterned deposition; /264/216/427/
Citation Formats
Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, and Kodas, T T. Methods for patterned deposition on a substrate. United States: N. p., 1995.
Web.
Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, & Kodas, T T. Methods for patterned deposition on a substrate. United States.
Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, and Kodas, T T. Sun .
"Methods for patterned deposition on a substrate". United States. https://www.osti.gov/servlets/purl/869700.
@article{osti_869700,
title = {Methods for patterned deposition on a substrate},
author = {Rye, Robert R and Ricco, Antonio J and Hampden-Smith, M J and Kodas, T T},
abstractNote = {A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}
Works referenced in this record:
Selective low-temperature chemical vapor deposition of copper from (hexafluoroacetylacetonato)copper(I)trimethylphosphine, (hfa)CuP(Me)3
journal, May 1991
- Kodas, Toivo T.; Shin, H. -K.; Chi, K. -M.
- Advanced Materials, Vol. 3, Issue 5