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Title: Methods for patterned deposition on a substrate

A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.
 [1];  [1];  [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
OSTI Identifier:
Sandia Corporation (Albuquerque, NM) SNL
Patent Number(s):
US 5380474
Contract Number:
Research Org:
Country of Publication:
United States
methods; patterned; deposition; substrate; method; described; depositions; material; surface; polymeric; etched; form; layer; enhanced; adhesions; characteristics; selected; portions; removed; define; pattern; diminished; adhesion; conductor; remaining; embodiment; ptfe; chemically; improve; copper; thereto; thereafter; irradiated; laser; beam; remove; patterns; polymeric substrate; laser beam; selected portion; selected portions; adhesion characteristics; etched surface; chemically etched; enhanced adhesion; patterned deposition; /264/216/427/