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Title: Magnetron sputtering source

Abstract

A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal.

Inventors:
 [1];  [2];  [3];  [2]
  1. Livermore, WA
  2. Livermore, CA
  3. Brentwood, CA
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
OSTI Identifier:
869417
Patent Number(s):
5333726
Assignee:
Regents of University of California (Oakland, CA)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
magnetron; sputtering; source; coating; substrates; thermal; conductivity; electrically; insulating; ceramic; magnetically; attached; sputter; target; eliminate; vacuum; sealing; direct; fluid; cooling; cathode; assembly; design; results; compactness; improved; operating; characteristics; versatility; fabrication; cost; easily; retrofits; apparatuses; provides; safe; easy; effective; replacement; installation; removal; magnetron sputter; improved operating; magnetron sputtering; operating characteristics; electrically insulating; thermal conductivity; sputter target; cathode assembly; vacuum seal; sputtering source; sputtering apparatus; cost effective; insulating ceramic; fabrication cost; operating characteristic; source design; attached sputter; direct fluid; magnetically attached; /204/

Citation Formats

Makowiecki, Daniel M, McKernan, Mark A, Grabner, R Fred, and Ramsey, Philip B. Magnetron sputtering source. United States: N. p., 1994. Web.
Makowiecki, Daniel M, McKernan, Mark A, Grabner, R Fred, & Ramsey, Philip B. Magnetron sputtering source. United States.
Makowiecki, Daniel M, McKernan, Mark A, Grabner, R Fred, and Ramsey, Philip B. Sat . "Magnetron sputtering source". United States. https://www.osti.gov/servlets/purl/869417.
@article{osti_869417,
title = {Magnetron sputtering source},
author = {Makowiecki, Daniel M and McKernan, Mark A and Grabner, R Fred and Ramsey, Philip B},
abstractNote = {A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {1}
}